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Renesas Electronics Corp. is seeking a Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume packaging and assembly for next‑generation devices.
You will drive execution to meet production output, delivery commitments, and revenue targets across global lines, collaborating with engineering, quality, and supply chain. The role requires deep expertise in packaging technologies (e.g., SiC/GaN, DBC/AMB, wirebond, flip-chip) and a track record of successful NPI-to-HVM
Renesas Electronics Corp. is seeking a Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume packaging and assembly for next‑generation devices.
You will drive execution to meet production output, delivery commitments, and revenue targets across global lines, collaborating with engineering, quality, and supply chain. The role requires deep expertise in packaging technologies (e.g., SiC/GaN, DBC/AMB, wirebond, flip-chip) and a track record of successful NPI-to-HVM