Senior Packaging Ops Leader – NPI to High-Volume

Renesas Electronics Corp.

Shah Alam

On-site

MYR 200,000 - 320,000

Full time

13 days ago

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Job summary

Renesas Electronics Corp. is seeking a Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume packaging and assembly for next‑generation devices.

You will drive execution to meet production output, delivery commitments, and revenue targets across global lines, collaborating with engineering, quality, and supply chain. The role requires deep expertise in packaging technologies (e.g., SiC/GaN, DBC/AMB, wirebond, flip-chip) and a track record of successful NPI-to-HVM

Qualifications

  • 10+ years in semiconductor packaging/assembly operations with ramp experience.
  • 3+ years leading manufacturing, engineering, or cross-functional teams.
  • Strong knowledge of packaging processes and reliability methods.
  • Experience with OSAT partners and global manufacturing ecosystems.

Responsibilities

  • Lead day-to-day semiconductor package assembly operations across global product lines.
  • Drive output, yield, cycle time, and cost performance with data-driven management.
  • Partner with Package Engineering, Quality, and Supply Chain to ensure manufacturability.
  • Own NPI ramp readiness and high-volume manufacturing execution.
  • Lead process changes and maintain robust production controls with partners.

Skills

Leadership
NPI to HVM
OSAT management
Packaging tech

Education

Bachelor in Electrical Engineering
Master's preferred

Tools

SPC
DOE

Job description

Renesas Electronics Corp. is seeking a Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume packaging and assembly for next‑generation devices.

You will drive execution to meet production output, delivery commitments, and revenue targets across global lines, collaborating with engineering, quality, and supply chain. The role requires deep expertise in packaging technologies (e.g., SiC/GaN, DBC/AMB, wirebond, flip-chip) and a track record of successful NPI-to-HVM

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