Director of IC Packaging & High-Volume Manufacturing

Renesas Electronics; Shah Alam; On-site; MYR 350,000 - 650,000; Full time

Benefits offered by this job

Competitive benefits

Job summary

Renesas Electronics seeks an experienced Director of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies. You will drive manufacturing excellence, quality, and continuous improvement across global operations, partnering with package engineering, R&D, Quality, Supply Chain and OSAT partners.

The leader ensures ramp readiness, cost-effective processes, and scalable production for AI/data center power

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.
• 12+ years of semiconductor manufacturing and packaging engineering experience.
• 5+ years of leadership experience managing engineering teams in semiconductor environments.
• Strong expertise in package assembly processes: wirebond, flip chip, wafer-level packaging, MCMs, molding, singulation, SMT.
• Experience with power packaging and wide-bandgap packaging (SiC, GaN); DBC/AMB knowledge a plus.
• Experience with global OSAT partners and outsourced manufacturing ecosystems.
• Proven track record of successful NPI-to-HVM product ramp.

Responsibilities

• Lead sustaining engineering across semiconductor package assembly technologies and product lines.
• Drive high-volume manufacturing performance in yield, cycle time, quality, throughput and cost.
• Establish engineering systems for process control, defect reduction, and continuous improvement.
• Align assembly engineering roadmaps with business growth and packaging technology strategies.
• Partner with OSAT teams to ensure manufacturable designs and robust production controls.
• Lead process change management for materials, equipment, flows, and sites.
• Drive NPI-to-production ramp readiness and structured ramp execution.

Skills

Wire binding

Flip chip

Wafer-level packaging

Molding

Singulation

SMT

Power packaging

SiC/GaN packaging

DBC/AMB

OSAT management

NPI-to-HVM

Education

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline

Master’s degree (preferred)

Tools

None

Job description

Renesas Electronics seeks an experienced Director of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies. You will drive manufacturing excellence, quality, and continuous improvement across global operations, partnering with package engineering, R&D, Quality, Supply Chain and OSAT partners.

The leader ensures ramp readiness, cost-effective processes, and scalable production for AI/data center power