Senior IC Packaging & Assembly Engineering Manager

Renesas Electronics; Shah Alam; On-site; MYR 300,000 - 420,000; Full time

Job summary

Renesas Electronics seeks an experienced Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and manufacturing execution for advanced packaging technologies.

You will focus on yield improvement, process stability, and ramp readiness while partnering with Package Engineering, Quality, Supply Chain, and external OSAT partners for NPI transfers into high-volume manufacturing.

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical, Chemical, or related technical discipline.
• 12+ years of semiconductor manufacturing and packaging engineering experience with exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
• 5+ years leading technical projects, coordinating engineering activities, or mentoring engineers in semiconductor environments.
• Strong expertise in package assembly processes including wirebond, flip chip, wafer-level packaging, MCM, molding, singulation, SMT, and power packaging technologies.
• Knowledge of SPC, DOE, reliability, qualification methods, and statistical analysis tools.
• Experience working with global OSAT partners and outsourced manufacturing ecosystems.
• Experience supporting NPI-to-HVM ramp execution.
• Strong knowledge of semiconductor quality systems and change management.
• Strong communication and cross-functional collaboration skills.

Responsibilities

• Support sustaining engineering across semiconductor package assembly technologies and product lines.
• Execute manufacturing improvements related to yield, cycle time, quality, throughput, and cost.
• Apply engineering practices for process control, defect reduction, and continuous improvement.
• Provide technical input to assembly engineering plans aligned with package technology and product needs.
• Collaborate with Package Engineering and OSAT teams to support manufacturable designs and stable production controls.
• Monitor assembly yield performance, trends, and corrective action progress.
• Investigate process, reliability, and customer quality issues through root-cause analysis.
• Maintain KPIs and dashboards to track performance and improvement.
• Support QA, reliability, audits, and supplier collaborations.
• Coordinate NPI transfers to high-volume manufacturing ramps.

Skills

Semiconductor packaging

Cross-functional collaboration

Structured problem solving

Data-driven yield improvement

Project coordination

Root-cause analysis

Education

Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline

Job description

Renesas Electronics seeks an experienced Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and manufacturing execution for advanced packaging technologies.

You will focus on yield improvement, process stability, and ramp readiness while partnering with Package Engineering, Quality, Supply Chain, and external OSAT partners for NPI transfers into high-volume manufacturing.