Senior Manager, Power IC Packaging & HVM

Renesas Electronics Corp.; Hang Tuah Jaya; On-site; MYR 180,000 - 300,000; Full time

Job summary

Renesas Electronics Corp. is seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies, including SiC and GaN.

You will partner with OSATs, R&D, Quality, and Supply Chain to ensure yield, process control, and ramp readiness while translating development intent into scalable production.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, Mechanical, Chemical Engineering, or related field.
• 15+ years in semiconductor manufacturing and packaging engineering.
• 3+ years leading projects or managing small teams.
• Expertise in FET wafer metallization, wirebond, flip chip, reflow, molding, and package assembly.
• Strong knowledge of yield analysis, SPC, DOE, reliability and qualification methods.
• Experience working with OSAT partners and NPI-to-HVM transfers.

Responsibilities

• Support sustaining engineering across semiconductor package assembly technologies.
• Drive high-volume manufacturing improvements for yield, cycle time, quality, throughput and cost.
• Develop engineering practices for process control, defect reduction and continuous improvement.
• Collaborate with Package Engineering and OSAT teams to ensure manufacturable designs.
• Monitor yield performance and lead data-driven improvement initiatives.
• Manage process change, qualification and ramp readiness for new products.
• Coordinate with cross-functional teams and external partners for high-volume ramp.

Skills

Semiconductor packaging assembly

Data-driven problem solving

Cross-functional collaboration

Yield analysis

NPI to HVM ramp experience

Education

Bachelor's degree in Electrical Engineering or related field

Tools

SPC

DOE

Statistical analysis tools

OSAT coordination

Job description

Renesas Electronics Corp. is seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies, including SiC and GaN.

You will partner with OSATs, R&D, Quality, and Supply Chain to ensure yield, process control, and ramp readiness while translating development intent into scalable production.