Senior Manager, Semiconductor Packaging & HVM Leadership

Aitomic Jobs; Shah Alam; On-site; MYR 180,000 - 240,000; Full time

Job summary

Renesas Electronics is seeking a Senior Manager of Semiconductor IC Packaging & Assembly Engineering in Shah Alam, Malaysia. The role focuses on sustaining engineering and high-volume manufacturing for advanced packaging technologies, including AI/data center power applications and wide-bandgap materials.

Collaboration with Package Engineering, R&D, Quality, and Supply Chain will drive ramp readiness and process robustness.

Qualifications

• Senior-level experience in semiconductor packaging assembly engineering.

Responsibilities

• Manufacturing & Sustaining Engineering Execution for semiconductor package assembly technologies.
• Yield Monitoring & Continuous Improvement with data-driven problem solving.
• Quality & Reliability management across OSAT partners and internal teams.
• Process Change Management for transfers, tooling, and ramp readiness.

Job description

Renesas Electronics is seeking a Senior Manager of Semiconductor IC Packaging & Assembly Engineering in Shah Alam, Malaysia. The role focuses on sustaining engineering and high-volume manufacturing for advanced packaging technologies, including AI/data center power applications and wide-bandgap materials.

Collaboration with Package Engineering, R&D, Quality, and Supply Chain will drive ramp readiness and process robustness.