Global Semiconductor Packaging & Assembly Ops Leader

Renesas Electronics Corporation; Bayan Lepas; On-site; MYR 350,000 - 550,000; Full time

Job summary

Renesas Electronics Corporation is seeking an experienced Senior Manager to lead semiconductor IC packaging and assembly operations across global lines. You will drive high-volume manufacturing, optimize yield and cycle times, and partner with OSATs to ensure ramp readiness and on‑time customer deliveries.

A strong track record in packaging technologies and NPI-to-HVM is essential. The role demands hands-on leadership, data-driven decision making, and collaboration with Package Engineering,

Qualifications

• Bachelor's degree in Electrical Engineering or related technical discipline.
• 10+ years in semiconductor manufacturing, packaging, or assembly operations.
• 3+ years of leadership experience managing cross-functional teams in semiconductor environments.
• Deep expertise in package assembly processes (wirebond, flip chip, WLP, molding, SMT) and related technologies.
• Experience with OSAT partners, NPI‑to‑HVM transfers, and ramp readiness.
• Strong knowledge of quality systems, change management, and qualification methodologies.
• Experience with advanced packaging technologies (SiC, GaN, DBC, AMB) is a plus.

Responsibilities

• Lead day-to-day semiconductor package assembly operations across global product lines and partners.
• Drive execution to meet production output and delivery commitments.
• Manage capacity, throughput, cycle time, yield, and operating costs.
• Oversee RAMP readiness, NPI transfers, and production ramp execution.
• Collaborate with engineering,Quality, and Supply Chain to ensure manufacturable designs and robust production controls.
• Define KPIs and dashboards to monitor performance and delivery.

Skills

Leadership

Cross-functional collaboration

Data-driven execution

Manufacturing leadership

Analytical mindset

Project management

Communication

Education

Bachelor’s degree in Electrical Engineering

Master’s degree or PhD in Engineering

Tools

SPC

DOE

Statistical analysis tools

Job description

Renesas Electronics Corporation is seeking an experienced Senior Manager to lead semiconductor IC packaging and assembly operations across global lines. You will drive high-volume manufacturing, optimize yield and cycle times, and partner with OSATs to ensure ramp readiness and on‑time customer deliveries.

A strong track record in packaging technologies and NPI-to-HVM is essential. The role demands hands-on leadership, data-driven decision making, and collaboration with Package Engineering,