Senior Manager, High-Volume Semiconductor Packaging

Renesas Electronics Corp.; Bayan Lepas; On-site; MYR 300,000 - 420,000; Full time

Job summary

Renesas Electronics Corp. seeks a Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume packaging programs for advanced technologies, including SiC/GaN and DBC/AMB.

You translate NPI plans into scalable manufacturing, ensuring on-time delivery and revenue targets. You will partner with Package Engineering, Product Engineering, Quality, Supply Chain, Planning, Procurement, and OSATs to improve line readiness, yield, and cycle time, and to drive continuous

Qualifications

• Bachelor’s degree or higher in engineering or related technical discipline.
• 10+ years in semiconductor manufacturing, packaging, or assembly operations.
• 3+ years leadership experience in semiconductor environments.
• Expertise in package assembly processes: wirebond, flip chip, wafer-level packaging, molding, SMT, and related tech; experience with power packaging and WBG is valued.
• Experience with NPI-to-HVM ramp and managing OSAT partners.
• Strong analytical, organizational and cross-functional leadership skills.

Responsibilities

• Lead day-to-day semiconductor package assembly operations across global product lines and manufacturing partners.
• Drive execution to meet production output, delivery commitments, and revenue targets.
• Manage assembly capacity, throughput, cycle time, yield, labor and equipment utilization, and costs.
• Partner with Package Engineering, Product Engineering, Quality, Supply Chain, Planning, Procurement, and OSAT teams to ensure manufacturable designs and robust production controls.
• Define KPIs and dashboards to track production output, shipments, and manufacturing performance.
• Lead NPI ramp readiness and high-volume manufacturing execution for new products.
• Oversee OSAT operations and supplier management to ensure quality and on-time delivery.
• Foster team leadership and capability growth; drive continuous improvement in packaging operations.

Skills

Semiconductor packaging

Operations leadership

NPI to HVM ramp

Data-driven execution

Cross-functional collaboration

Education

Bachelor’s degree in Electrical/Materials/Mechanical/Industrial Engineering

Job description

Renesas Electronics Corp. seeks a Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume packaging programs for advanced technologies, including SiC/GaN and DBC/AMB.

You translate NPI plans into scalable manufacturing, ensuring on-time delivery and revenue targets. You will partner with Package Engineering, Product Engineering, Quality, Supply Chain, Planning, Procurement, and OSATs to improve line readiness, yield, and cycle time, and to drive continuous