Senior Packaging Development Engineer - Leadframe Package/Ceramic

Texas Instruments; Malacca City; On-site; MYR 60,000 - 90,000; Full time

Job summary

Texas Instruments in Malaysia is seeking a Packaging Engineer to join a global team of engineering minds. You will work hands-on to optimize FOL processes such as Face2Face Flip Chip and Reflow, and contribute to swivel molding characterization for dual-side cooling MCM packages.

The role involves defining simplified manufacturing sequences, leading multiple new product executions from kick-off to release, and collaborating with factory operations and platform teams to advance technology

Responsibilities

• Hands on or optimizing FOL process such as Face2Face Flip Chip & Reflow process as well as swivel molding characterization for dual side cooling MCM package
• Defining simplified FOL and EOL manufacturing process sequence for power stage package
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc.
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
• Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.

Job description

Packaging Engineer

About TI

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We're committed to building a better future - from the responsible manufacturing of our semiconductors to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us - change the world, love your job!

About the job

As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.

Put your talent to work with us as a Packaging engineer - change the world, love your job!

Responsibilities include:

• Hands on or optimizing FOL process such as Face2Face Flip Chip & Reflow process as well as swivel molding characterization for dual side cooling MCM package
• Defining simplified FOL and EOL manufacturing process sequence for power stage package
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc.
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
• Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.