Senior Packaging Development Engineer - Substrate Modules

Texas Instruments; Malacca City; On-site; MYR 120,000 - 200,000; Full time

Job summary

Texas Instruments in Malaysia is seeking an experienced Manufacturing Packaging Engineer to optimize high-speed attachment processes, streamline stack-up and molding, and drive robust process parameters across product families.

You will lead multi-project executions from kick-off through prototyping, qualification, and RTM, collaborate with factory operations and global teams, and contribute to technology roadmaps enabling competitive, reliable power module packaging.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field.
• CGPA 3.3 or above and at least 5 years of manufacturing semiconductor experience.
• Hands-on skills operating machines and optimizing materials/processes for yield improvement.

Responsibilities

• Optimize and establish robust, high-speed process parameters for component attach, stack-up, and molding technologies.
• Define simplified manufacturing sequences for different components attach.
• Lead multi-project executions from kick-off through prototyping, characterization, learning cycles, and qualifications to RTM.
• Collaborate closely with factory operations to meet indices, quality, and cost targets.
• Engage with global teams to execute technology roadmaps and establish process capabilities.

Skills

Manufacturing experience

Process optimization

Yield improvement

Machine operation

Cross-functional collaboration

Education

Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or related field

Tools

JMP

Job description

Job Description

Change the world. Love your job.

As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.

Responsibilities May Include

• Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
• Defining simplified manufacturing process sequence for different components attach
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment

Qualifications

Minimum requirements:

• Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of study
• Cumulative > 3.3 CGPA and above
• Minimum 5 years' experience in the manufacturing semiconductor field
• Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement

Preferred Qualifications

• Package layer design expertise such as structural configuration, material selection and process flow design
• Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.
• Hands on experience on system-in-Package (SiP), including exposed Inductor integration solutions is added advantage.
• Knowledge of power module packaging processes, including understanding of Design for Manufacturability (DFM) constraints and module package defect criteria.
• Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)
• Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution
• Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.
• Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
• Experience with assembly of power modules packaging, substrate design and reliability requirements
• Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
• Key personal characters – trustworthy, inclusive, innovative, competitive, result-oriented

About Us

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

About The Team

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.