Leadframe & Ceramic Packaging Engineer – MCM Modules

Texas Instruments; Malacca City; On-site; MYR 60,000 - 90,000; Full time

Job summary

Texas Instruments in Malaysia is seeking a Packaging Engineer to join a global team of engineering minds. You will work hands-on to optimize FOL processes such as Face2Face Flip Chip and Reflow, and contribute to swivel molding characterization for dual-side cooling MCM packages.

The role involves defining simplified manufacturing sequences, leading multiple new product executions from kick-off to release, and collaborating with factory operations and platform teams to advance technology

Responsibilities

• Hands on or optimizing FOL process such as Face2Face Flip Chip & Reflow process as well as swivel molding characterization for dual side cooling MCM package
• Defining simplified FOL and EOL manufacturing process sequence for power stage package
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc.
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
• Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.

Job description

Texas Instruments in Malaysia is seeking a Packaging Engineer to join a global team of engineering minds. You will work hands-on to optimize FOL processes such as Face2Face Flip Chip and Reflow, and contribute to swivel molding characterization for dual-side cooling MCM packages.

The role involves defining simplified manufacturing sequences, leading multiple new product executions from kick-off to release, and collaborating with factory operations and platform teams to advance technology