Packaging Engineer (Module Package Development)

MVC Resources; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

MVC Resources is partnering with a Global Semiconductor pioneer in Melaka, seeking a Senior/Lead Packaging Engineer to lead end-to-end module package development for substrate-based solutions. The role reports to the Packaging Section Manager and requires strong expertise in high-performance analog, mixed-signal and power packaging.

You will drive architecture, design reviews, test structures, and collaboration across R&D and manufacturing to deliver reliable, high-density packages for data

Job description

Company Overview

Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. Operating an advanced back-end R&D and manufacturing hub in Melaka, the company designs and manufactures cutting-edge integrated circuits and module solutions powering data centers, AI accelerators, cloud computing servers, and automotive architectures. To support next-generation power density requirements and high-performance computing platforms, the Package Development team is seeking a Senior/Lead Packaging Engineer.

Position Overview

Reporting to the Packaging Section Manager, the Packaging Engineer (Module Package Development) leads the end-to-end package development architecture for Substrate-Basei…