Senior OSAT Packaging PM: PCB Embedding & Power Modules

Infineon Technologies; Ipoh; On-site; MYR 180,000 - 280,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a Senior Project Manager OSAT to drive development of packaging platforms and power modules. You will steer PCB embedding and panel-level packaging initiatives, coordinating with global partners to ensure maturity and readiness for high-volume production.

The role requires leadership of international teams, strong technical background in advanced packaging, and collaboration across business units and subcontractors. Apply to shape next-gen power solutions.

Qualifications

• Master degree in Mechanical/Electrical/Material Science/Physics; PhD a plus.
• Minimum 7 years of experience in semiconductor technology or manufacturing and assembly.
• At least 5 years leading complex development projects; IPMA-C certification or equivalent is a plus.
• Strong technical background in advanced packaging technologies and assembly processes.
• Knowledge in PCB manufacturing, Chip Embedding, Power Module packaging and assembly.
• Experience with semiconductor subcontractors.
• Good understanding of quality requirements for semiconductor products and packages.
• Ability to lead cross-functional and global teams in multicultural environments.
• Strong communication skills in English and Chinese; German is a plus.

Responsibilities

• Be responsible for package/process development projects in collaboration with Infineon BUs and global subcon partners, ensuring maturity and smooth transition into serial production.
• Focus on PCB Embedding and Panel Level Packaging for next generation Power Modules.
• Lead package innovation projects from definition to high volume integration.
• Enable and release new Subcons, package/technology platforms, and derivatives.
• Manage change projects affecting package, process or subcontractor.
• Lead international and multidisciplinary teams (Europe, US, Asia).
• Support platform assessments between subcons and second source introduction.
• Support Subcon/Technology roadmap alignment.

Skills

Self-motivation

Team player

Cross-functional collaboration

Decision making under uncertainty

Multicultural teamwork

English & Chinese communication

German language is a plus

Education

Master's degree in Mechanical/Electrical/Material Science/Physics

PhD is a plus

Tools

IPMA-C certification

Job description

Infineon Technologies in Malaysia seeks a Senior Project Manager OSAT to drive development of packaging platforms and power modules. You will steer PCB embedding and panel-level packaging initiatives, coordinating with global partners to ensure maturity and readiness for high-volume production.

The role requires leadership of international teams, strong technical background in advanced packaging, and collaboration across business units and subcontractors. Apply to shape next-gen power solutions.