Module Engineer: Advanced Packaging & Assembly Excellence

Intel Technology Sdn. Bhd.; Kulim; On-site; MYR 72,000 - 110,000; Full time

Benefits offered by this job

Medical

Miscellaneous allowance

Education support

Dental

Sports

Parking

Vision

Meal subsidy

Daily free fruits

Mother's room

Job summary

Intel Technology Sdn. Bhd. in Kulim seeks a Module Engineer to own and optimize high-volume equipment and processes for advanced packaging and assembly. You will drive performance, yield, and cost improvements while supporting technology transfers and capacity expansion.

The role requires 0–5+ years in semiconductor manufacturing or related fields, strong SPC knowledge, and experience with metrology tools and DOEs. Collaboration with global teams and suppliers is essential for success.

Qualifications

• 0–5+ years of experience in semiconductor manufacturing, assembly, packaging, or equipment engineering.
• SPC knowledge and structured problem-solving methodologies.
• Experience owning, maintaining, and improving equipment.
• Familiar with JMP, SQL, Power BI.
• Capable of working in cleanroom environments.
• Experience in semiconductor assembly and advanced packaging processes.
• Die attach, flip-chip, TCB, Cu pillar/microbump, WLP, or advanced interconnects.
• Experience with metrology and process characterization tools (X-ray, AOI, Warpage, microscopy).
• DOE, FMEA, process characterization and yield improvement methodologies.

Responsibilities

• Own and optimize manufacturing equipment and processes to meet safety, quality, productivity, yield, and cost targets.
• Monitor critical process parameters and analyze data for stability and defect reduction.
• Perform testing, troubleshooting, and root cause investigations using data-driven methods.
• Drive process and equipment improvements to boost manufacturing performance.
• Execute equipment installation, qualification, maintenance, and repair activities.
• Support factory ramps, capacity expansion, and new technology introductions.
• Develop and implement excursion prevention systems and corrective actions.
• Collaborate with global sites for process alignment and tech transfers.
• Work with suppliers and cross-functional teams to improve readiness and capability.
• Support CI initiatives focused on safety, quality, reliability, and excellence.

Skills

SPC knowledge

Data analysis

Troubleshooting

DOE/FMEA

Problem solving

Education

Bachelor's degree in Mechanical/Electrical/Chemical/Materials Engineering

Tools

JMP

SQL

Power BI

Job description

Intel Technology Sdn. Bhd. in Kulim seeks a Module Engineer to own and optimize high-volume equipment and processes for advanced packaging and assembly. You will drive performance, yield, and cost improvements while supporting technology transfers and capacity expansion.

The role requires 0–5+ years in semiconductor manufacturing or related fields, strong SPC knowledge, and experience with metrology tools and DOEs. Collaboration with global teams and suppliers is essential for success.