Senior Engineer Package Development

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a packaging engineer to define and develop the right package for new products from concept to realization. You will drive technical definition activities for package development projects, including BOM, package design, assembly technology, PRP review, and project classification.

You will generate outlines, finalize drawings, define characteristics to meet electrical, thermal, mechanical, and reliability requirements, and coordinate cost

Qualifications

• Bachelor’s degree in Engineering or related field; semiconductor focus preferred.
• 2–3 years in IC/semiconductor manufacturing environment.
• Knowledge of semiconductor packaging, assembly and testing processes.
• Understanding of failure analysis and reliability methodologies.

Responsibilities

• Drive technical definition activities for package development projects (BOM, design, assembly tech, PRP review).
• Generate package outlines and internal drawings; finalize and maintain package documentation.
• Define package characteristics to meet electrical, thermal, mechanical and reliability requirements.
• Coordinate package cost estimation (A1–A3) and cost indication (A3) activities.
• Collaborate with BE assembly technologies to define package solutions for back-end processes.
• Provide pre-development support and act as the package design expert throughout the project lifecycle.

Skills

IC Packaging

Semiconductor Packaging

AutoCAD

3D Drafting

Reliability Engineering

Education

Bachelor's Degree in Engineering

Tools

AutoCAD

3D Drafting Tools

Job description

To define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization.

Your Role
Key responsibilities in your new role:

Drive technical definition activities for package development projects, including BOM, package design, assembly technology, PRP review, and project classification for new packages and major package changes.

Generate conceptual package outlines and internal construction drawings, finalize and maintain package documentation, and update package drawings as required.

Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.

Coordinate package cost estimation (A1-A3) and cost indication (A3) activities.

Collaborate with partners and technical consultants to define package solutions for Business Divisions, particularly in back-end (BE) assembly technologies.

Support pre-development and project definition phases, and serve as the package design expert throughout the project lifecycle.

Your Profile
Qualifications and skills to help you succeed:

Bachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, or Electronics Physics.

Minimum 2-3 years of relevant working experience in an IC or semiconductor manufacturing environment.

Knowledge of semiconductor packaging, assembly, and testing processes.

Familiarity with process engineering and equipment engineering principles.

Understanding of failure analysis and reliability engineering methodologies.

Experience with AutoCAD and 3D drafting tools is an added advantage.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

Your application will include the following questions:

• Which of the following statements best describes your right to work in Malaysia?
• Which of the following types of qualifications do you have?
• How many years of experience do you have in the Semiconductor Industry?

Consumer Electronics Manufacturing More than 10,000 employees

Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization & digitalization. As a global semiconductor leader in power systems & loT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.

Revenue in fiscal year 2023: more than €16 billion

About 58600 employees worldwide (Sept'23)

69 R&D & 17 manufacturing locations

Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization & digitalization. As a global semiconductor leader in power systems & loT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.

Revenue in fiscal year 2023: more than €16 billion

About 58600 employees worldwide (Sept'23)