Senior Package Platform Development Lead

Infineon Technologies AG; Penang; On-site; MYR 277,557 - 396,511; Full time

Benefits offered by this job

Diversity and inclusion

Supportive work environment

Job summary

Infineon Technologies AG in Penang is seeking a skilled professional to oversee outsourced package platform qualification and process optimization. This role requires significant experience in package development, including module assembly and wafer-level packaging.

The ideal candidate will hold a degree in engineering and possess over 10 years of relevant experience. Strong analytical and communication skills are crucial for success in this collaborative, diverse environment.

Qualifications

• Minimum 10 years' experience of package development in new product introduction.
• 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB.

Responsibilities

• Responsible for outsourced package platform qualification and process optimization.
• Define process and select Bill of Material.
• Enable new package platform and derivatives packages.

Skills

Analytical skills

Communication skills

Problem-solving

Team collaboration

Education

Master or Bachelor degree in Engineering disciplines

Tools

Knowledge of laminates and lead frame packages

Experience in Subcon management

Job description

Infineon Technologies AG in Penang is seeking a skilled professional to oversee outsourced package platform qualification and process optimization. This role requires significant experience in package development, including module assembly and wafer-level packaging.

The ideal candidate will hold a degree in engineering and possess over 10 years of relevant experience. Strong analytical and communication skills are crucial for success in this collaborative, diverse environment.