Lead Packaging Engineer — Drive IC Packaging Innovation

Infineon Technologies (Malaysia) Sdn Bhd

Malacca City

On-site

MYR 180,000 - 320,000

Full time

14 days+

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Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Senior Staff Engineer Package Technology to drive advanced packaging projects across electrical, thermal, mechanical and reliability requirements.

The role covers technical definition, cost estimation coordination, liaison with business divisions, pre-development activities, and technology scouting throughout the project lifecycle. Strong packaging knowledge is essential.

Qualifications

Bachelor's degree in engineering or related field is required.
Minimum 7 years in the IC/semiconductor industry with packaging expertise.
Experience with packaging, assembly and test processes and related equipment.
Knowledge of failure analysis and reliability engineering is preferred.
Strong analytical and problem‑solving abilities, with good communication.

Responsibilities

Drive technical definition activities for package projects with major changes or business impact.
Develop package outlines, drawings, and maintain design updates.
Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
Coordinate package cost estimation and cost indication processes.
Serve as liaison and technical consultant to Business Divisions on package definition.
Support pre-development and project definition phases, acting as package design expert.
Scout emerging packaging technologies and monitor competitor/developer activity.
Consolidate inputs for ADR and ensure content accuracy for A-projects.
Act as primary contact and coach for packaging matters throughout the project lifecycle.