Senior Package Design Engineer

Biz N Consumer Solutions Pte Ltd; Penang; On-site; MYR 180,000 - 240,000; Full time

Job summary

Biz N Consumer Solutions Pte Ltd in Malaysia is seeking an experienced semiconductor packaging engineer to evaluate packaging solutions, assess substrate and BOM, and develop ballmap layouts for high-density packages.

You will collaborate with customer backend teams on bump selection and verification, design 2.5D/3D packaging processes, and support production with failure analysis and process improvements.

Qualifications

• Bachelor's degree or above in semiconductor packaging / materials / mechanical engineering, with more than 8 years of full-time packaging.
• Familiarity with and understanding of process flows and design points of FCBGA, FCCSP, WLCSP, WLBGA, MCM, SiP and other packaging types. Proficiency in using Cadence APD and AutoCAD.
• Understanding of various performance indicators and key points in packaging.
• Familiar with packaging-related reliability testing standards.
• Experience in 2.5D/3D packaging is a plus.
• Strong team spirit, willing to communicate and share knowledge.

Responsibilities

• 1. Evaluate and select chip packaging solutions, including assessment of substrate/package factory capabilities, BOM formulation, packaging size/stacking specification and ballmap layout.
• 2. Collaborate with internal and customer backend teams for bump selection, layout, and verification.
• 3. Iterative design of high-speed Serdes, DDR, HBM PHY. Packaging development related to IPs.
• 4. Design of packaging substrates and related document outputs, including substrate layout, POD, gerber, assembly instructions, etc.
• 5. Collaborate with SI/PI teams and system design teams for packaging optimization.
• 6. Coordinate and assist in problem-solving during production stages, conduct failure analysis, and assist in process improvements at packaging factories.
• 7. Develop advanced packaging 2.5D, 3D processes, and packaging technologies.

Skills

Packaging know-how

High-speed Serdes

Team collaboration

Failure analysis

Education

Bachelor's degree in semiconductor packaging / materials / mechanical engineering

Tools

Cadence APD

AutoCAD

Job description

• 1. Evaluate and select chip packaging solutions, including assessment of substrate/package factory capabilities, BOM formulation, packaging size/stacking specification and ballmap layout.
• 2. Collaborate with internal and customer backend teams for bump selection, layout, and verification.
• 3. Iterative design of high-speed Serdes, DDR, HBM PHY. Packaging development related to IPs.
• 4. Design of packaging substrates and related document outputs, including substrate layout, POD, gerber, assembly instructions, etc.
• 5. Collaborate with SI/PI teams and system design teams for packaging optimization.
• 6. Coordinate and assist in problem-solving during production stages, conduct failure analysis, and assist in process improvements at packaging factories.
• 7. Develop advanced packaging 2.5D, 3D processes, and packaging technologies.

Job Requirements:

• 1. Bachelor's degree or above in semiconductor packaging / materials / mechanical engineering, with more than 8 years of full-time packaging
• 2. Familiarity with and understanding of process flows and design points of FCBGA, FCCSP, WLCSP, WLBGA, MCM, SiP and other packaging types. Proficiency in using Cadence APD and AutoCAD.
• 3. Understanding of various performance indicators and key points in packaging.
• 4. Familiar with packaging-related reliability testing standards.
• 5. Experience in 2.5D/3D packaging is a plus.
• 6. Strong team spirit, willing to communicate and share knowledge.