IC Packaging Design, Manager (IC封裝)

Johnson Electric Group; Penang; On-site; MYR 255,000 - 401,000; Full time

Job summary

Johnson Electric Group in China is seeking an experienced Package Design Engineer to lead the development of MOSFET packaging, focusing on lead frame based solutions. You will create detailed 3D CAD models, specify materials, and drive designs from concept through high-volume production.

You will perform multi-physics simulations (thermal, electrical, mechanical), correlate results with lab data, and collaborate with silicon design, test, reliability, and manufacturing teams to deliver robust,

Qualifications

• 5+ years in semiconductor package development focusing on power devices (MOSFETs/IGBTs).
• BS in Mechanical/Electrical Engineering; MS preferred.
• Strong knowledge of packaging processes: die attach, wire bonding, molding.
• Familiarity with JEDEC and AEC-Q101 reliability standards.

Responsibilities

• Lead design and development of MOSFET packages, including lead frame based solutions.
• Create 3D CAD models and define critical dimensions, materials, and assembly drawings.
• Perform multi-physics simulations (thermal, electrical, mechanical) and validate with data.
• Collaborate with silicon design, test, reliability, and manufacturing teams.
• Document designs, rules, and best practices; support new product introductions.

Skills

Power device packaging

3D CAD expertise

Cross-functional collaboration

Reliability & testing knowledge

Education

Bachelor of Science in engineering

Master's degree preferred

Tools

AutoCAD

SolidWorks

Creo

Q3D Extractor

Ansys Icepak

HFSS

Job description

Working location: China (Open to international applicants—visa sponsorship provided for qualifying candidates)

Key Responsibilities

• Package Design & Development:
• Lead the design and development of new MOSFET packages, especially for lead frame based (e.g. DFN).
• Lead frame and clip frame design experience is preferred.
• Create detailed package models using 3D CAD software and define all critical dimensions, material stack-ups, and assembly drawings.
• Optimize package designs for superior electrical performance (low RDS(on), low parasitic inductance/capacitance), thermal performance (low RthJC), and mechanical robustness.
• Simulation & Analysis:
• Perform multi-physics simulations, including thermal (e.g., Ansys Icepak, SolidWorks Simulation), electrical (e.g., Q3D Extractor, HFSS), and mechanical stress analysis to predict and validate package performance.
• Analyze simulation results to identify design trade-offs and drive design improvements.
• Correlate simulation models with empirical data from lab characterization to ensure accuracy.
• Material Selection & Qualification:
• Evaluate and select packaging materials, including leadframes, mold compounds, die-attach materials, and bonding wires, to optimize performance, reliability, and cost.
• Work with suppliers to qualify new materials and processes.
• Cross-Functional Collaboration:
• Collaborate closely with silicon design, test engineering, product engineering, and reliability teams to ensure package designs meet all product specifications.
• Partner with PE and EE to develop robust manufacturing processes, troubleshoot yield issues, and ensure smooth new product introductions.
• Interface with application engineers to understand customer requirements and translate them into package design criteria.
• Documentation & Process Improvement:
• Maintain comprehensive design documentation, including specifications, simulation reports, and assembly procedures.
• Contribute to the development of internal design rules, guidelines, and best practices for package engineering.
• Stay current with industry trends, emerging packaging technologies, and competitive landscape.

Required Qualifications

• Education: Bachelor of Science (B.S.) in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field. A Master of Science (M.S.) is highly preferred.
• Experience:
• 5+ years of direct experience in semiconductor package development, with a strong focus on power devices (MOSFETs or IGBTs).
• Proven track record of successfully taking packages from concept through design, simulation, and high-volume manufacturing.
• Technical Skills:
• Proficiency in 3D CAD software (e.g., AutoCAD, SolidWorks, Creo).
• Strong understanding of semiconductor packaging processes, including die attach, wire bonding, and molding.
• Deep knowledge of power semiconductor physics, including thermal management, parasitics, and failure mechanisms.
• Familiarity with reliability testing standards and methodologies (e.g., JEDEC, AEC-Q101) for automotive and industrial applications.