Senior Staff Specialist Package Technology Development

Infineon Technologies; Penang; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies in Penang seeks an experienced engineering professional to lead outsourced package platform qualification and process optimization. You will define OSAT tasks, assess risks, and ensure BOM and process alignment to meet MSL and reliability targets.

The role requires deep experience in wafer‑level packaging, SiP, and collaboration across design, manufacturing, and subcontractors. Strong communication and project management are essential.

Qualifications

• Master’s or Bachelor’s degree in an engineering discipline.
• Minimum 10 years of experience in package development and 3 years in project management.
• Experience with module assembly, wafer‑level package (WLP), bumping, eWLB and SiP is highly advantageous.
• Knowledge of laminate and lead frame packages and interaction with design and process functions.
• Strong understanding of quality requirements and release criteria (JEDEC/AEC).

Responsibilities

• Lead and participate in outsourced package platform qualification and process optimization to meet targets.
• Define package definition tasks in OSAT segment and assess project risk with mitigations.
• Create assembly specifications, marking instructions, and packing specs for databasing.
• Apply design rules and support OSAT technical capability assessments.
• Define process and select BOM to meet MSL and reliability requirements.
• Enable new package platforms and derivative packages at OSAT and support subcon enabling.
• Drive platform‑related task forces and lead technical problem solving.

Skills

Analytical skills

Problem solving

Communication skills

Teamwork

Stakeholder management

Education

Master’s or Bachelor’s degree in engineering

Job description

Responsibilities

• Lead and participate in outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet time‑to‑market, product quality, process capability, and assembly yield targets.
• Define package definition tasks in the OSAT segment, including project complexity definition with Delta assessment list, project category assessment, and project risk assessment with mitigation actions.
• Integrate unit processes until process freeze for assembly and test at subcons, creating assembly specifications, marking instructions, and packing specifications for upload into the database.
• Apply and verify design rules based on established baseline documents and specific equipment and process capability of assembly sites; support OSAT technical capability assessment.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre‑development.
• Enable new package platforms and derivative packages, supporting technology and package development at OSAT, including new subcon enabling support.
• Act as a driver or co‑driver for platform‑related task force activities and drive technical problem‑solving.

Qualifications and Skills

• Master’s or Bachelor’s degree in an engineering discipline.
• Minimum 10 years of experience in package development in new product introduction or process (Pre‑assembly, assembly, and test) and at least 3 years in supporting project management.
• Experience with module assembly, wafer‑level package (WLP), bumping, eWLB, and System in Package (SiP) is highly advantageous.
• Good knowledge of processes and materials for both laminate and lead frame packages and ability to interact with design, design rules, and process functions.
• Strong understanding of quality requirements and release criteria (e.g., JEDEC/AEC grades) that align with product/package design and BOM selection.
• Strong analytical skills, problem‑solving ability, and a commitment to high quality standards.
• Active knowledge transfer and best‑practice sharing across organizational boundaries; ambitious and able to make timely decisions.
• Highly motivated, able to prioritize and perform under pressure, and capable of motivating and involving team members and stakeholders.
• Collaborative teamwork skills with various stakeholders and partners in multi‑site and multi‑cultural teams.
• Strong communication and interpersonal skills at all levels; experience in subcontractor management.