Senior Package Definition & Integration Engineer

Infineon Technologies AG; Malacca City; On-site; MYR 90,000 - 120,000; Full time

Job summary

Infineon Technologies AG is seeking to drive technology integration activities to ensure the package fulfills all requirements in process interaction. You will work as a key partner for FE colleagues on new FE technology and support pre development for chip tech.

The role covers DFMEA/ PFMEA, risk interaction, and integration of unit processes in the package platform, with a strong focus on collaboration with FE and BE teams to ensure reliability and smooth cross-disciplinary workflows.

Qualifications

• Bachelor's Degree in Engineering with 10+ years in IC/semiconductor environment SMT, Packaging, Assembly and Test.
• Knowledge of FE/BE and BE/BE Interaction; DFMEA/PFMEA.

Responsibilities

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform - Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Skills

Communication

Collaboration

Negotiation

Solution finding

DFMEA/PFMEA knowledge

Internal package analysis

Education

Bachelor's Degree in Engineering

Tools

8D & T6s

DFMEA/PFMEA

Be/BE interaction

Job description

Infineon Technologies AG is seeking to drive technology integration activities to ensure the package fulfills all requirements in process interaction. You will work as a key partner for FE colleagues on new FE technology and support pre development for chip tech.

The role covers DFMEA/ PFMEA, risk interaction, and integration of unit processes in the package platform, with a strong focus on collaboration with FE and BE teams to ensure reliability and smooth cross-disciplinary workflows.