Senior Staff Engineer Package Technology

Infineon Technologies AG; Malacca City; On-site; MYR 180,000 - 240,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks a Senior Staff Engineer for Package Technology in our R&D team. You will drive technical definitions for major package projects, develop layouts and drawings, and ensure designs meet electrical, thermal, mechanical, and reliability requirements.

You will coordinate cost estimation activities and act as a technical consultant across divisions, while proactively scouting new packaging technologies and leading pre-development efforts.

Qualifications

• Bachelor's Degree in Engineering, preferable in Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or Physics.
• Minimum 7 years of relevant working experience in the IC or semiconductor industry.
• Strong knowledge of semiconductor packaging, assembly and test processes, and equipment engineering.
• Knowledge of failure analysis and reliability engineering.

Responsibilities

• Drive technical definition activities for package projects with major changes or business impacts, including BOM, package design, assembly technology, PRP reviews, and project classification.
• Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and maintain drawing updates as required.
• Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
• Coordinate package cost estimation activities (A1-A3) and cost indication processes (A3).
• Serve as the key liaison and technical consultant to Business Divisions on package definition, particularly regarding backend assembly technology expertise.
• Support pre-development and project definition phases, and act as the package design expert throughout the project lifecycle.
• Proactively scout emerging packaging technologies and maintain awareness of developments within competitors and subcontractors.
• Consolidate inputs for ADR and ensure content accuracy and timely updates for A-projects.
• Act as the primary contact person, technical consultant, and coach for all matters related to packaging, package design, and package development.
• Drive innovation and pre-development activities within the package platform.

Skills

Semiconductor packaging

Assembly & test processes

Failure analysis

Reliability engineering

Analytical skills

AutoCAD

3D drafting

Backend assembly technology

Education

Bachelor's Degree in Engineering

Tools

AutoCAD

3D drafting

Job description

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Staff Engineer Package Technology in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role Key responsibilities in your new role

• Drive technical definition activities for package projects involving major changes, new package developments, significant risks, or business impacts, including BOM, package design, assembly technology, PRP reviews, and project classification.
• Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and maintain drawing updates as required.
• Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
• Coordinate package cost estimation activities (A1-A3) and cost indication processes (A3).
• Serve as the key liaison and technical consultant to Business Divisions on package definition, particularly regarding backend assembly technology expertise.
• Support pre-development and project definition phases, and act as the package design expert throughout the project lifecycle.
• Proactively scout emerging packaging technologies and maintain awareness of developments within competitors and subcontractors.
• Consolidate inputs for ADR and ensure content accuracy and timely updates for A-projects.
• Act as the primary contact person, technical consultant, and coach for all matters related to packaging, package design, and package development.
• Drive innovation and pre-development activities within the package platform.

Your profile Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics Engineering, or Physics.
• Minimum 7 years of relevant working experience in the IC or semiconductor industry.
• Strong knowledge of semiconductor packaging, assembly and test processes, and equipment engineering.
• Knowledge of failure analysis and reliability engineering.
• Strong analytical and problem-solving skills.
• Proficiency in AutoCAD and 3D drafting is preferred.

#WeAreIn for driving decarbonization and digitalization

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals.

Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.