Lead Principal Engineer Package Definition

Infineon Technologies AG; Malacca City; In loco; MYR 90.000 - 120.000; Tempo pieno

Descrizione del lavoro

Infineon Technologies AG is seeking to drive technology integration activities to ensure the package fulfills all requirements in process interaction. You will work as a key partner for FE colleagues on new FE technology and support pre development for chip tech.

The role covers DFMEA/ PFMEA, risk interaction, and integration of unit processes in the package platform, with a strong focus on collaboration with FE and BE teams to ensure reliability and smooth cross-disciplinary workflows.

Competenze

• Bachelor's Degree in Engineering with 10+ years in IC/semiconductor environment SMT, Packaging, Assembly and Test.
• Knowledge of FE/BE and BE/BE Interaction; DFMEA/PFMEA.

Mansioni

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform - Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Conoscenze

Communication

Collaboration

Negotiation

Solution finding

DFMEA/PFMEA knowledge

Internal package analysis

Formazione

Bachelor's Degree in Engineering

Strumenti

8D & T6s

DFMEA/PFMEA

Be/BE interaction

Descrizione del lavoro

Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.

Your role

Key responsibilities in your new role

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Your profile

Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge.
• Good aptitude for communication, collaboration, negotiation and solution finding.
• Knowledge of FE/BE and BE/BE Interaction.
• Knowledge of 8D & T6s methodology.
• Knowledge of DFMEA/PFMEA.
• Knowledge of Internal Package analysis/ first level reliability.

WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.