Senior Engineer Package Development

Infineon Technologies AG

Malacca City

On-site

MYR 80,000 - 140,000

Full time

5 days ago
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Job summary

Infineon Technologies AG in Malaysia seeks a Senior Engineer to advance package development within its Research & Development team. You will blend creativity with deep technical expertise to shape innovative packaging solutions, drive major project changes, and deliver reliable, cost-effective designs.

The role requires a Bachelor's in engineering and 2–3 years in IC/semiconductor packaging, with knowledge of processing, reliability, and testing.

Qualifications

  • Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics).
  • 2–3 years of relevant experience in an IC/semiconductor environment.
  • Knowledge of semiconductor packaging, assembly, and testing.
  • Understanding of process and equipment engineering.
  • Knowledge of failure analysis and reliability engineering.
  • AutoCAD and 3D drafting proficiency preferred.

Responsibilities

  • Drive technical definition activities for package projects, including BOM, design, and cost review.
  • Generate conceptual package outlines and internal construction drawings.
  • Finalize and maintain package drawings with updates as required.
  • Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
  • Coordinate package cost estimation (A1-A3) and cost indication (A3).
  • Liaise with partners on back-end assembly technology and project lifecycle involvement.

Skills

Semiconductor know-how
Electrical/mechanical aptitude
Team collaboration

Education

Bachelor's degree in Engineering

Tools

AutoCAD
3D drafting

Job description

WeAreIn for jobs that impact everyone's life

What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Engineer Package Development in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Key responsibilities
  • Drive technical definition activities for package projects involving major changes, new package development, risks, and impact assessment, including BOM, package design, assembly technology, PRP review, and project classification.
  • Generate conceptual package outlines and internal construction drawings.
  • Finalize, document, and maintain package drawings, ensuring updates are implemented when required.
  • Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
  • Coordinate package cost estimation (A1-A3) and cost indication (A3).
  • Liaise with partners and technical consultants on package definition activities, particularly regarding back-end assembly technology expertise for the Business Division.
  • Support pre-development and project definition stages and serve as the package design expert throughout the project lifecycle.
Qualifications and skills
  • Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics).
  • Minimum 2-3 years of relevant working experience in an IC or semiconductor environment.
  • Knowledge of semiconductor packaging, assembly, and testing.
  • Understanding of process and equipment engineering.
  • Knowledge of failure analysis and reliability engineering.
  • Proficiency in AutoCAD and 3D drafting is preferred.
WeAreIn for driving decarbonization and digitalization

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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