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Infineon Technologies AG in Malaysia seeks a Senior Engineer to advance package development within its Research & Development team. You will blend creativity with deep technical expertise to shape innovative packaging solutions, drive major project changes, and deliver reliable, cost-effective designs.
The role requires a Bachelor's in engineering and 2–3 years in IC/semiconductor packaging, with knowledge of processing, reliability, and testing.
What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Engineer Package Development in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.