Senior Staff Engineer: Tech Integration & Packaging

Infineon Technologies AG; Malacca City; On-site; MYR 80,000 - 120,000; Full time

Job summary

Infineon Technologies AG in Malacca City seeks an experienced professional to drive Technology Integration activities ensuring process fulfillment. The role involves PBC and TPC assessments, risk assessments, and integration of FE and BE technologies.

The ideal candidate holds a Bachelor's Degree in Engineering with a decade of experience in semiconductor environments and possesses strong communication and collaboration skills. Join us in a diverse and inclusive working environment.

Qualifications

• 10 years of working experience in IC/semiconductor environment.
• Experience in SMT, Semiconductor Packaging, Assembly, and Test knowledge.

Responsibilities

• Drive Technology Integration activities for Process Interaction.
• Conduct PBC and TPC assessment.
• Lead the Package Technology DFMEA Process of Record.
• Oversee Risk Interaction assessment and mitigation work packages.
• Integrate unit processes in package platform.
• Collaborate with FE in FE/BE interaction.

Skills

Communication skills

Collaboration skills

Negotiation skills

Solution finding

Knowledge of FE/BE Interaction

Knowledge of 8D & T6s methodology

Knowledge of DFMEA/PFMEA

Knowledge of Internal Package analysis

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Job description

Infineon Technologies AG in Malacca City seeks an experienced professional to drive Technology Integration activities ensuring process fulfillment. The role involves PBC and TPC assessments, risk assessments, and integration of FE and BE technologies.

The ideal candidate holds a Bachelor's Degree in Engineering with a decade of experience in semiconductor environments and possesses strong communication and collaboration skills. Join us in a diverse and inclusive working environment.