Senior Staff Engineer Technology Integration

Infineon Technologies AG; Malacca City; On-site; MYR 80,000 - 120,000; Full time

Job summary

Infineon Technologies AG in Malacca City seeks an experienced professional to drive Technology Integration activities ensuring process fulfillment. The role involves PBC and TPC assessments, risk assessments, and integration of FE and BE technologies.

The ideal candidate holds a Bachelor's Degree in Engineering with a decade of experience in semiconductor environments and possesses strong communication and collaboration skills. Join us in a diverse and inclusive working environment.

Qualifications

• 10 years of working experience in IC/semiconductor environment.
• Experience in SMT, Semiconductor Packaging, Assembly, and Test knowledge.

Responsibilities

• Drive Technology Integration activities for Process Interaction.
• Conduct PBC and TPC assessment.
• Lead the Package Technology DFMEA Process of Record.
• Oversee Risk Interaction assessment and mitigation work packages.
• Integrate unit processes in package platform.
• Collaborate with FE in FE/BE interaction.

Skills

Communication skills

Collaboration skills

Negotiation skills

Solution finding

Knowledge of FE/BE Interaction

Knowledge of 8D & T6s methodology

Knowledge of DFMEA/PFMEA

Knowledge of Internal Package analysis

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Job description

Your Role

Drive Technology Integration activities to ensure the package fulfills all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.

Key Responsibilities

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform – Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Your Profile

Qualifications and Skills

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge.
• Good aptitude for communication, collaboration, negotiation and solution finding.
• Knowledge of FE/BE and BE/BE Interaction.
• Knowledge of 8D & T6s methodology.
• Knowledge of DFMEA/PFMEA.
• Knowledge of Internal Package analysis/ first level reliability.

Equal Employment Opportunity

We embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.