Cross-Platform Technology Integration Lead

Infineon Technologies AG

Malacca City

On-site

MYR 300,000 - 460,000

Full time

14 days+

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Job summary

Infineon Technologies AG is seeking a Principal Engineer in Cross Platform Technology Integration to harmonize activities across platforms and drive best practices. You will lead cross-platform technology projects, act as a TI lead for new technology, and own risk assessment work packages while coordinating FE/BE interactions and 8D/problem-solving efforts.

The role requires extensive semiconductor experience, strong packaging/test knowledge, and excellent communication and collaboration skills

Qualifications

Bachelor’s degree in engineering with relevant semiconductor focus.
Experience in IC/semiconductor environments is required.
Strong knowledge in packaging, assembly and test.

Responsibilities

Harmonize technology integration across multiple platforms and share best practices.
Provide leadership for cross-platform technology projects and ensure alignment.
Act as TI lead for multi-platform new technology initiatives.
Responsible for PBC and TPC assessment.
Own risk interaction assessment and mitigation work packages.
Oversee pre-development for new chip technology across platforms.
Align unit process integration (BOM/Process) with different packaging platforms.
Collaborate with FE in FE/BE interactions and integration topics.
Lead 8D/problem-solving for interaction issues and share lessons learned across platforms.
Provide technical guidance across projects related to interaction topics.