Senior Manager, NPI-to-HVM Semiconductor Packaging

Private Advertiser

Bayan Lepas

On-site

MYR 300,000 - 420,000

Full time

3 days ago

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Job summary

Private Advertiser in Malaysia seeks a Senior Manager to lead high-volume semiconductor IC packaging and assembly operations across global partners. You will drive manufacturing readiness, NPI-to-HVM transfers, and yield improvements while ensuring on-time delivery and product quality across AI, data center, industrial, automotive, and power applications.

The role covers advanced power packaging (SPS, VPS, power modules, Discrete FET), and wide-bandgap technologies (SiC, GaN) with DBC/AMB

Qualifications

Bachelor's degree in a technical field.
10+ years in semiconductor manufacturing, packaging, assembly, or manufacturing operations.
Leadership experience managing cross-functional teams in semiconductor environments.

Responsibilities

Lead day-to-day semiconductor package assembly operations across global product lines and manufacturing partners.
Drive production output, delivery commitments, and manufacturing execution to meet targets.
Manage assembly capacity, throughput, cycle time, yield, and cost performance.
Establish performance metrics and escalation mechanisms for predictable execution.
Collaborate with Engineering, Quality, Supply Chain, Planning, and Operations teams to optimize performance.
Oversee NPI-to-production transfers and high-volume manufacturing ramps.
Develop manufacturing readiness plans covering equipment, materials, and labor needs.

Skills

Leadership

NPI to HVM

Yield analysis

Operational excellence

Cross-functional collaboration

Strategic planning

Education

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain Management, or related technical discipline