Senior Leader, Semiconductor Packaging & Assembly Engineering

Private Advertiser

Hang Tuah Jaya

On-site

MYR 180,000 - 360,000

Full time

5 days ago

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Job summary

Private Advertiser in Malaysia seeks a Senior Manager / Manager in Semiconductor Packaging & Assembly Engineering to lead manufacturing packaging and assembly activities, driving yield improvement and cost optimization.

You will support NPI and HVM ramps, develop robust process controls, and mentor engineering teams while collaborating with internal and external partners to raise manufacturing performance and reliability.

Qualifications

Bachelor's Degree in Engineering or related disciplines.
Minimum 12 years in semiconductor packaging/assembly/manufacturing engineering.
Experience with OSATs or outsourced semiconductor manufacturing partners.
Experience with NPI-to-HVM transfer and product ramp.
Knowledge of JEDEC, IPC standards preferred.

Responsibilities

Lead packaging and assembly engineering activities for manufacturing operations.
Drive yield improvement, defect reduction, quality enhancement, and cost optimization.
Support NPI and HVM ramp activities.
Develop and improve assembly process controls and best practices.
Conduct root cause analysis and implement corrective actions.
Collaborate with internal teams and external partners to resolve issues.
Monitor KPIs and drive continuous improvement.
Provide technical leadership and mentoring to engineering teams.