Senior IC Packaging Design Lead (Power MOSFETs)

Johnson Electric Group; Penang; Presencial; MYR 255.000 - 401.000; Jornada completa

Descripción de la vacante

Johnson Electric Group in China is seeking an experienced Package Design Engineer to lead the development of MOSFET packaging, focusing on lead frame based solutions. You will create detailed 3D CAD models, specify materials, and drive designs from concept through high-volume production.

You will perform multi-physics simulations (thermal, electrical, mechanical), correlate results with lab data, and collaborate with silicon design, test, reliability, and manufacturing teams to deliver robust,

Formación

• 5+ years in semiconductor package development focusing on power devices (MOSFETs/IGBTs).
• BS in Mechanical/Electrical Engineering; MS preferred.
• Strong knowledge of packaging processes: die attach, wire bonding, molding.
• Familiarity with JEDEC and AEC-Q101 reliability standards.

Responsabilidades

• Lead design and development of MOSFET packages, including lead frame based solutions.
• Create 3D CAD models and define critical dimensions, materials, and assembly drawings.
• Perform multi-physics simulations (thermal, electrical, mechanical) and validate with data.
• Collaborate with silicon design, test, reliability, and manufacturing teams.
• Document designs, rules, and best practices; support new product introductions.

Conocimientos

Power device packaging

3D CAD expertise

Cross-functional collaboration

Reliability & testing knowledge

Educación

Bachelor of Science in engineering

Master's degree preferred

Herramientas

AutoCAD

SolidWorks

Creo

Q3D Extractor

Ansys Icepak

HFSS

Descripción del empleo

Johnson Electric Group in China is seeking an experienced Package Design Engineer to lead the development of MOSFET packaging, focusing on lead frame based solutions. You will create detailed 3D CAD models, specify materials, and drive designs from concept through high-volume production.

You will perform multi-physics simulations (thermal, electrical, mechanical), correlate results with lab data, and collaborate with silicon design, test, reliability, and manufacturing teams to deliver robust,