IC Packaging, Senior Manager (IC封裝)

Johnson Electric Group; Penang; On-site; MYR 612,000 - 857,000; Full time

Job summary

Johnson Electric Group is seeking an experienced IC Packaging Senior Manager to drive packaging innovation for automotive MOSFET/MCU products. You will lead projects, optimize packaging processes, and collaborate with cross-functional teams to reduce costs without compromising reliability.

The ideal candidate has hands-on DFN5x6 and QFN packaging experience, a deep understanding of physical characteristics, and a track record in top packaging environments.

Qualifications

• Hands-on experience in automotive MOSFET/MCU packaging.
• Experience in top packaging companies or packaging departments within leading IC companies.
• Proven ability to innovate packaging solutions for cost reduction.
• Expertise in process optimization to achieve cost savings without sacrificing reliability or quality.

Responsibilities

• Lead and manage IC packaging projects, focusing on automotive MOSFET/MCU packaging (e.g., DFN5x6, QFN).
• Deeply understand and optimize the physical characteristics of each packaging process.
• Innovate packaging solutions to reduce costs while maintaining high standards of reliability and quality.
• Collaborate with cross-functional teams to implement process improvements and cost-saving initiatives.
• Stay updated with industry trends and advancements in IC packaging technologies.

Skills

Automotive MOSFET packaging

DFN5x6

QFN packaging

Packaging process optimization

Cost reduction

Leadership

Education

Master's degree

Job description

Working location: China (Open to international applicants- visa sponsorship provided for qualifying candidates)

Job Description:

We are seeking an experienced IC Packaging Senior Manager to join our dynamic team. The ideal candidate will have extensive hands‑on experience in automotive MOSFET/MCU packaging and a deep understanding of the physical characteristics of each packaging process. This role requires a proven track record in top packaging companies or packaging departments within leading IC companies. The IC Packaging Senior Manager will be responsible for driving packaging innovation and process optimization to achieve cost reductions without compromising reliability or quality.

Key Responsibilities:

• Lead and manage IC packaging projects, focusing on automotive MOSFET/MCU packaging (e.g., DFN5*6, QFN).
• Deeply understand and optimize the physical characteristics of each packaging process.
• Innovate packaging solutions to reduce costs while maintaining high standards of reliability and quality.
• Collaborate with cross-functional teams to implement process improvements and cost‑saving initiatives.
• Stay updated with industry trends and advancements in IC packaging technologies.

Requirements:

• Hands‑on experience in automotive MOSFET/MCU packaging, specifically DFN5*6 and QFN.
• In‑depth knowledge of the physical characteristics of each packaging process.
• Experience working in top packaging companies or packaging departments within leading IC companies.
• Proven ability to innovate packaging solutions for cost reduction.
• Expertise in process optimization to achieve cost savings without sacrificing reliability or quality.
• Master's degree or above from a top university is preferred.

Preferred Qualifications:

• Strong problem‑solving skills and attention to detail.
• Excellent communication and leadership abilities.
• Ability to work effectively in a fast‑paced, collaborative environment.