Senior Packaging Engineer - Leadframe & Ceramic MCM

Texas Instruments Incorporated; Malacca City; Presencial; MYR 60 000 - 90 000; Tempo integral

Resumo da oferta

Texas Instruments Incorporated is seeking a Packaging Engineer to join a global team of engineering professionals in Malaysia. You will work on defining and optimizing front-end-of-life (FOL) processes, plus reliability and yield improvements for power stage packages.

You will collaborate with factory operations and design teams, apply JMP analysis, FMEA, and control plans, and support process advancement across multi-function groups to strengthen package capabilities and competitiveness.

Qualificações

• Hands on or optimizing FOL process such as Face2Face Flip Chip & Reflow process as well as swivel molding characterization for dual side cooling MCM package
• Defining simplified FOL and EOL manufacturing process sequence for power stage package
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc.
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
• Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.

Descrição da oferta de emprego

Texas Instruments Incorporated is seeking a Packaging Engineer to join a global team of engineering professionals in Malaysia. You will work on defining and optimizing front-end-of-life (FOL) processes, plus reliability and yield improvements for power stage packages.

You will collaborate with factory operations and design teams, apply JMP analysis, FMEA, and control plans, and support process advancement across multi-function groups to strengthen package capabilities and competitiveness.