Senior FC-FE Die Attach & Underfill Engineer

NXP Semiconductors NV

Kuala Lumpur

On-site

MYR 120,000 - 180,000

Full time

14 days+

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Job summary

NXP Semiconductors NV seeks a Senior Flip-Chip Front-End Packaging Development Engineer – Die Attach & Underfill to lead FC-FE die attach and underfill process development, optimization, and integration. You will drive DOE studies, troubleshoot defects, and coordinate with cross-functional teams to improve yield, reliability, and readiness for production.

You will own process parameters, collaborate on new package platforms, and mentor staff while advancing NPI readiness and process

Qualifications

Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related discipline.
Minimum of five years in semiconductor packaging, with FC-FE die attach and underfill exposure.
Hands-on experience with DOE, 8D, Fishbone, 5-Why, and FTA.
Experience in high‑volume manufacturing and fast-paced development.
Knowledge of process controls, CSAM, and reliability testing.

Responsibilities

Take ownership of FC-FE die attach and underfill processes across advanced packages.
Define and optimize process parameters for die placement, bonding, reflow, and underfill dispensing.
Lead DOE activities to improve yield, reliability, void control, and CSAM performance.
Drive root-cause analysis and implement corrective actions for yield excursions.
Collaborate with cross-functional teams to ensure robust process integration and readiness.