Underfill Process Engineer, SiP & Flip-Chip

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD.; Johor; On-site; MYR 60,000 - 110,000; Full time

Job summary

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD. seeks an experienced Underfill Process Engineer to develop and optimize capillary and molded underfill processes for SiP and flip-chip products.

You will program and maintain automated dispensing platforms and evaluate underfill materials for reliability. The role requires a Bachelor’s in a relevant engineering field and at least 3 years in semiconductor assembly or advanced packaging, with hands-on dispensing equipment experience and strong analytical

Qualifications

• Strong analytical and problem-solving abilities for failure analysis and process optimization.
• Proficient in DOE, SPC, and process capability analysis.
• Experience with/understanding of capillary and molded underfill processes.
• Hands-on with automated dispensing equipment, Nordson ASYMTEK preferred.

Responsibilities

• Develop, qualify, and optimize capillary and molded underfill processes for SiP and flip-chip products.
• Establish parameters for dispensing, curing, fillet formation and coverage.
• Program and maintain automated dispensing platforms (Nordson ASYMTEK or similar).
• Evaluate underfill materials for viscosity, Tg, CTE, modulus, adhesion, cure profile, reliability.
• Investigate defects and perform failure analysis using CSAM, X-ray, microscopy, and cross-sectioning.
• Support NPI, process transfer, equipment qualification, and production ramp-up.

Skills

Analytical thinking

Troubleshooting

Documentation

Cross-functional communication

Education

Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering

Tools

Nordson ASYMTEK

Job description

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD. seeks an experienced Underfill Process Engineer to develop and optimize capillary and molded underfill processes for SiP and flip-chip products.

You will program and maintain automated dispensing platforms and evaluate underfill materials for reliability. The role requires a Bachelor’s in a relevant engineering field and at least 3 years in semiconductor assembly or advanced packaging, with hands-on dispensing equipment experience and strong analytical