Underfill Process Engineer, Flip‑Chip Assembly

Sandisk; Penang; On-site; MYR 120,000 - 180,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks a Senior Underfill Process Engineer to lead the UF process for flip-chip die-level assembly and drive yield improvements in high-volume production. You will develop new Underfill processes, run DOE studies, establish recipes, and mentor technicians while collaborating with Quality, Manufacturing and Product Engineering teams.

Strong background in semiconductor assembly, FMEA/SPC/DOE, and hands-on problem solving is essential to sustain process capability and

Qualifications

• Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, or related).
• Minimum 4-5 years of experience in semiconductor assembly process engineering.
• Experience in Underfill process development and sustaining.
• Strong knowledge of semiconductor assembly processes and flip-chip die-level assembly technology.
• Hands-on approach with a focus on production support, yield improvement, and quality excellence.

Responsibilities

• Own the Underfill (UF) process for flip-chip die-level assembly and drive process efficiency.
• Support assembly process engineering with solutions meeting quality and KPI targets.
• Lead process qualifications to achieve CTQ, CPK, and cost objectives.
• Provide technical training and mentoring on UF best practices to technicians and engineers.

Skills

Flip-chip UF process

Cross-functional collaboration

Yield improvement

Problem solving

Education

Bachelor's Degree in Engineering

Tools

Nordson dispenser

Heller reflow oven

C-Scan equipment

Job description

Sandisk in Penang, Malaysia seeks a Senior Underfill Process Engineer to lead the UF process for flip-chip die-level assembly and drive yield improvements in high-volume production. You will develop new Underfill processes, run DOE studies, establish recipes, and mentor technicians while collaborating with Quality, Manufacturing and Product Engineering teams.

Strong background in semiconductor assembly, FMEA/SPC/DOE, and hands-on problem solving is essential to sustain process capability and