Flip-Chip Packaging Engineer: Die Attach & Underfill

NXP Semiconductors; Kuala Lumpur; Hybrid; MYR 171,000 - 286,000; Full time

Job summary

NXP Semiconductors in Kuala Lumpur seeks a Senior Flip-Chip Front-End Packaging Development Engineer to lead die attach and underfill process development, optimization, and integration across advanced package platforms.

You will drive DOE-based improvements, perform root-cause analysis for yield excursions, and collaborate with design and reliability teams to ensure robust process performance and timely production release.

Qualifications

• Bachelor's degree in Mechanical Engineering, Materials Science or Chemical Engineering specified in the ad.
• Minimum five years of experience in semiconductor packaging, with FC-FE die attach and underfill exposure.
• Experience with high-volume manufacturing and fast-paced development environments.

Responsibilities

• Lead FC-FE die attach and underfill process development, optimization, and integration for package platforms.
• Drive DOE activities to improve yield, reliability, and process window.
• Perform root-cause analysis and implement corrective actions for yield excursions.
• Collaborate with cross-functional teams for NPI readiness and process documentation.
• Evaluate and qualify FC-FE materials and related consumables to ensure performance.

Skills

Process development

DOE

Troubleshooting

Yield improvement

Material qualification

Equipment readiness

Data analysis

CSAM

Die attach

Underfill dispensing

Reflow

DFM awareness

Education

Mechanical Engineering

Materials Science

Chemical Engineering

Tools

AI-based simulation tools

CSAM equipment

Job description

NXP Semiconductors in Kuala Lumpur seeks a Senior Flip-Chip Front-End Packaging Development Engineer to lead die attach and underfill process development, optimization, and integration across advanced package platforms.

You will drive DOE-based improvements, perform root-cause analysis for yield excursions, and collaborate with design and reliability teams to ensure robust process performance and timely production release.