Underfill Process Engineer – Semiconductor Packaging

Sandisk; Simpang Ampat; On-site; MYR 56,000 - 89,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks an Underfill Process Engineer to own the flip-chip die-level Underfill steps and drive process improvements. You will collaborate with Process Engineering, Quality, and Manufacturing to meet CTQ, CPK, yield, and cost targets while setting up new recipes and documenting procedures.

The role requires a degree in engineering and 1–2 years in semiconductor manufacturing, with strong analytical and communication skills to support production operations and knowledge

Qualifications

• Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, Chemical Engineering, or a related field).
• 1-2 years of relevant working experience in semiconductor manufacturing, assembly, packaging, process engineering, or related engineering fields.
• Basic understanding of semiconductor assembly and packaging processes.
• Fundamental knowledge of flip-chip assembly, underfill processes, or semiconductor manufacturing technologies.
• Strong analytical, troubleshooting, and problem-solving skills.
• Basic understanding of engineering and statistical concepts.

Responsibilities

• Responsible for the Underfill (UF) process for flip-chip die-level assembly.
• Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
• Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.
• Set up new Underfill processes, materials, and recipes, including process window studies, DOE execution, and corner limit evaluations.
• Establish golden recipes for new package qualifications.
• Lead process qualifications to achieve CTQ requirements, CPK targets, risk assessment requirements, UPH, yield, and cost objectives.
• Lead new product qualifications and ensure effective process handover and technology transfer.
• Support the qualification of new materials, equipment, and tools.

Skills

Analytical thinking

Problem-solving

Communication

Teamwork

Attention to detail

Data analysis

Time management

Self-motivation

Education

Bachelor's Degree in Engineering

Tools

Nordson dispensing systems

Heller reflow ovens

C-Scan inspection equipment

Minitab

JMP

MATLAB

Python

Job description

Sandisk in Penang, Malaysia seeks an Underfill Process Engineer to own the flip-chip die-level Underfill steps and drive process improvements. You will collaborate with Process Engineering, Quality, and Manufacturing to meet CTQ, CPK, yield, and cost targets while setting up new recipes and documenting procedures.

The role requires a degree in engineering and 1–2 years in semiconductor manufacturing, with strong analytical and communication skills to support production operations and knowledge