Underfill Process Engineer

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD.; Johor; On-site; MYR 60,000 - 110,000; Full time

Job summary

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD. seeks an experienced Underfill Process Engineer to develop and optimize capillary and molded underfill processes for SiP and flip-chip products.

You will program and maintain automated dispensing platforms and evaluate underfill materials for reliability. The role requires a Bachelor’s in a relevant engineering field and at least 3 years in semiconductor assembly or advanced packaging, with hands-on dispensing equipment experience and strong analytical

Qualifications

• Strong analytical and problem-solving abilities for failure analysis and process optimization.
• Proficient in DOE, SPC, and process capability analysis.
• Experience with/understanding of capillary and molded underfill processes.
• Hands-on with automated dispensing equipment, Nordson ASYMTEK preferred.

Responsibilities

• Develop, qualify, and optimize capillary and molded underfill processes for SiP and flip-chip products.
• Establish parameters for dispensing, curing, fillet formation and coverage.
• Program and maintain automated dispensing platforms (Nordson ASYMTEK or similar).
• Evaluate underfill materials for viscosity, Tg, CTE, modulus, adhesion, cure profile, reliability.
• Investigate defects and perform failure analysis using CSAM, X-ray, microscopy, and cross-sectioning.
• Support NPI, process transfer, equipment qualification, and production ramp-up.

Skills

Analytical thinking

Troubleshooting

Documentation

Cross-functional communication

Education

Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering

Tools

Nordson ASYMTEK

Job description

About the role We are seeking an experienced Underfill Process Engineer to develop and optimize advanced underfill solutions for System-in-Package (SiP) products. You will lead capillary and molded underfill process development, dispensing-equipment optimization, material evaluation, defect reduction, and manufacturing yield improvement. This role offers the opportunity to work on advanced semiconductor packaging technologies and collaborate closely with R&D, product design, manufacturing, equipment, suppliers, and quality teams.

Key responsibilities Develop, qualify, and optimize capillary and molded underfill processes for SiP and flip-chip products.
Establish process parameters for dispensing, material flow, curing, fillet formation, and coverage.
Program and maintain automated dispensing platforms, including Nordson ASYMTEK or equivalent systems.
Evaluate underfill materials based on viscosity, flow performance, Tg, CTE, modulus, adhesion, cure profile, and reliability.
Apply DOE, statistical analysis, and process capability studies to define robust operating windows.
Investigate and eliminate defects such as voids, delamination, incomplete coverage, filler separation, overflow, and die contamination.
Conduct failure analysis using CSAM, X-ray, cross-sectioning, microscopy, and other analytical techniques.
Improve yield, cycle time, material utilization, equipment uptime, and overall manufacturing performance.
Prepare process specifications, control plans, work instructions, qualification reports, and technical documentation.
Support new-product introduction, process transfer, equipment qualification, and production ramp-up.

About you Bachelor's in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, or a related discipline.
At least 3 years of relevant experience in semiconductor assembly, advanced packaging, underfill, encapsulation, or precision fluid dispensing.
Strong understanding of flip-chip assembly, capillary flow, polymer behavior, curing mechanisms, and package reliability.
Hands-on experience with automated dispensing equipment; Nordson ASYMTEK experience is highly preferred.
Practical knowledge of underfill material properties, including viscosity, Tg, CTE, modulus, adhesion, moisture sensitivity, and flow rate.
Experience using CSAM, X-ray inspection, cross-sectioning, microscopy, and other failure-analysis methods.
Proficiency in DOE, SPC, statistical analysis, process capability, root-cause analysis, and corrective-action methodologies.
Experience in process qualification, equipment validation, new-product introduction, and high-volume manufacturing.
Strong analytical, troubleshooting, documentation, and cross-functional communication skills.