Automotive Semiconductor NPI Process Engineer
NXP Semiconductors
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Job summary
NXP Semiconductors in Malaysia is seeking a packaging engineer to develop and qualify new LQFP and BGA packages for automotive assembly.
You will lead process characterization, collaborate with cross-functional teams, and drive improvements in quality, yield, and cost while documenting specs and procedures.
The role requires 3–6 years in semiconductor assembly and hands-on experience with laser/plasma dicing, wire bonding, die attach, and mold processes.
Qualifications
- 3–6 years of semiconductor assembly experience for automotive customers.
- Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA packing development.
- Strong knowledge in process characterization for key processes such as laser dicing, plasma dicing, die bond, wire bonding, mold, ball attach, marking.
- Great interpersonal skills, leadership, results-oriented, self-driven.
- Proficient in SPC and Process Control; good problem-solving skills.
- Microsoft Office proficiency; project management knowledge is a plus.
Responsibilities
- Develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
- Responsible for quality, yield, cost and process improvement activities.
- Document process documentation, process specs, standard work instruction, OCAP, QIT, etc.
- Collaborate with cross-functional teams to resolve conflicts and make fast decisions to avoid risks.
- Take ownership to work with upper management to align scope and direction of key projects.
Skills
Tools
Job description
NXP Semiconductors in Malaysia is seeking a packaging engineer to develop and qualify new LQFP and BGA packages for automotive assembly.
You will lead process characterization, collaborate with cross-functional teams, and drive improvements in quality, yield, and cost while documenting specs and procedures.
The role requires 3–6 years in semiconductor assembly and hands-on experience with laser/plasma dicing, wire bonding, die attach, and mold processes.
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