Senior Flip Chip Process Engineer for Yield and Innovation

Sandisk; Penang; In loco; MYR 180.000 - 300.000; Tempo pieno

Descrizione del lavoro

Sandisk is seeking an experienced process engineer to own and optimize the Flip Chip Attach (FCA) process, ensuring quality, yield, and productivity targets are met across manufacturing. You will support advanced process engineering with DOE studies, recipe setup, and new package qualifications.

The role requires deep semiconductor manufacturing knowledge, hands-on experience with key FCA/SMT equipment, and a proven track record in process optimization and cross-functional collaboration.

Competenze

• Bachelor’s degree or higher in Electrical/Mechanical Engineering or related.
• 8–10 years in Flip Chip Attach process engineering; 6 years for PhD holders.
• Experience with thin die products for flip chip die-level assembly.
• Semiconductor industry experience required.
• Hands-on experience with the listed equipment (BESI Datacon, FUJI NXT, DEK NeoHorizon, Kohyoung & PARMI SPI/AOI).
• Strong knowledge of semiconductor assembly processes and manufacturing operations.
• Strong machine programming and troubleshooting skills.

Mansioni

• Own and support FCA process to meet quality, yield, cost, reliability, and productivity targets.
• Provide technical support to Advanced Process Engineering for process/equipment solutions.
• Monitor assembly and test yield related to FCA with KPIs.
• Develop and set up new FCA processes including DOE and design of experiments.
• Drive Golden Recipe configurations for new package qualifications.
• Lead introduction of new products and package processes into production.

Conoscenze

Flip Chip Attach process

Semiconductor manufacturing

Problem-solving

Process optimization

Team leadership

Formazione

Bachelor’s Degree in Electrical/Mechanical Engineering or related

Strumenti

BESI Datacon

FUJI NXT

DEK NeoHorizon

Kohyoung SPI/AOI

PARMI SPI/AOI

Descrizione del lavoro

Sandisk is seeking an experienced process engineer to own and optimize the Flip Chip Attach (FCA) process, ensuring quality, yield, and productivity targets are met across manufacturing. You will support advanced process engineering with DOE studies, recipe setup, and new package qualifications.

The role requires deep semiconductor manufacturing knowledge, hands-on experience with key FCA/SMT equipment, and a proven track record in process optimization and cross-functional collaboration.