Die Bond Engineer III — Adv Packaging & Process Innovation

Nexperia; Seremban; On-site; MYR 90,000 - 150,000; Full time

Job summary

Nexperia is seeking a Development Die Bond Engineer to develop, qualify, and industrialize new die attach technologies for semiconductor packaging. You will drive innovations from concept to high-volume manufacturing, collaborating with R&D, Product Development, Process Engineering, Quality, and Operations to deliver robust, cost-effective die bond solutions.

You will lead process development for new packages, run DOE experiments, evaluate new equipment, and support tech transfers to mass

Qualifications

• Bachelor's Degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field.
• 2-5 years of experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.
• Fresh graduates with strong academic achievements and relevant industrial exposure may be considered for entry-level positions.

Responsibilities

• Develop and qualify new die bond processes, materials, and assembly technologies.
• Lead process development activities for new semiconductor packages and products.
• Design and execute experiments (DOE) to optimize process performance and reliability.
• Evaluate and introduce new die bonding equipment, tools, and process capabilities.
• Support technology transfer from development to mass production.
• Conduct process characterization, capability studies, and reliability assessments.
• Perform root cause analysis for development-related process challenges.
• Collaborate with suppliers and equipment vendors on emerging technologies and process solutions.
• Generate technical documentation, process specifications, and qualification reports.

Skills

Die bond process development

DOE experiments

Process optimization

Root cause analysis

Collaborate with suppliers

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electronic Engineering

Bachelor's degree in Mechatronics Engineering

Bachelor's degree in Manufacturing Engineering

Bachelor's degree in Materials Engineering

Tools

Die bonding equipment

Job description

Nexperia is seeking a Development Die Bond Engineer to develop, qualify, and industrialize new die attach technologies for semiconductor packaging. You will drive innovations from concept to high-volume manufacturing, collaborating with R&D, Product Development, Process Engineering, Quality, and Operations to deliver robust, cost-effective die bond solutions.

You will lead process development for new packages, run DOE experiments, evaluate new equipment, and support tech transfers to mass