Senior Equipment Engineer – Die Attach & Wire Bonding

OSI Optoelectronics; Johor Bahru; On-site; MYR 89,000 - 167,000; Full time

Job summary

OSI Optoelectronics in Malaysia is seeking an Equipment Engineer to set up and troubleshoot die attach and wire bonding machines, and support NPI and process changes.

You will work with leadership and cross-functional teams to monitor MTBA, MTBF, OEE, and PM, and to develop new processes with DOE, validation, and documentation. Candidates should have 3–5 years hands-on semiconductor equipment experience and a relevant engineering degree.

Qualifications

• Bachelor's degree in a mechanical/electrical/electronics/mechatronics/materials science
• Minimum 3–5 years hands-on semiconductor equipment experience, esp. die attach, wire bonding and laser marking
• Solid understanding of die attach materials, wire bonding mechanisms and semiconductor packaging assembly
• Experience with SPC and FMEA beneficial.

Responsibilities

• Equipment setup and troubleshooting for die attach and wire bonding machines.
• Support NPI, package transfer and process change activities including DOE, validation and documentation.
• Monitor KPI: MTBA, MTBF, OEE, machine downtime, quality and preventive maintenance.
• Perform initial setup for new production runs and assist development of new processes.
• Assist in equipment conversions and major troubleshooting to smooth production lines.
• Execute preventive maintenance and drive improvements to equipment capability.
• Collaborate with Lead Engineers, production and quality to improve processes and equipment performance.
• Maintain records of maintenance and repair work.
• Develop and execute installation and process validation protocols with validation reports for machine qualification.
• Knowledge of SPC and FMEA.

Skills

OEE concepts

MTBA/MTBF

Troubleshooting

Cross-functional collaboration

Problem-solving

Communication

Autonomous work

Education

Bachelor's degree in mechanical, Electrical, Electronics, Mechatronics, or Materials Science

Tools

Datacon 2200 evo

ASM Die bonders (AD838/AD830/AD896/AD810)

ASM I hawk / Express

Aero LED Gold / Aluminium wire bonders

Palomar 8000 Gold wire bonder / K&S

Laser marking machines

Job description

OSI Optoelectronics in Malaysia is seeking an Equipment Engineer to set up and troubleshoot die attach and wire bonding machines, and support NPI and process changes.

You will work with leadership and cross-functional teams to monitor MTBA, MTBF, OEE, and PM, and to develop new processes with DOE, validation, and documentation. Candidates should have 3–5 years hands-on semiconductor equipment experience and a relevant engineering degree.