Engineer, Equipment (Die Attach / Wire Bond)

Amkor Technology; Selangor; On-site; MYR 60,000 - 90,000; Full time

Job summary

Amkor Technology in Telok Panglima Garang, Selangor, seeks an equipment engineer to support Die Attach and Wire Bond systems, ensuring stable production performance and high uptime. You will troubleshoot, analyze root causes, and drive 개선 initiatives for reliability and cost efficiency.

You will monitor key metrics, plan PM activities, and support NPI, process transfers, and equipment qualification, collaborating with Production, Process Engineering, Quality, and Maintenance teams.

Qualifications

• Bachelor’s degree in a relevant engineering field.
• 2+ years of semiconductor equipment engineering experience.
• Hands-on support for Die Attach and/or Wire Bond equipment.
• Strong systematic root cause analysis and troubleshooting skills.
• Experience with equipment qualification and process validation.
• Familiarity with OEE, MTBF, MTBA, downtime analysis.
• Effective communication and cross-functional teamwork.
• Self-motivated, analytical, and able to work independently.
• Willing to support shift work and urgent recovery tasks.
• Willing to work in Telok Panglima Garang, Selangor.

Responsibilities

• Lead equipment troubleshooting and root cause analysis to resolve issues quickly.
• Drive continuous improvement for reliability, productivity, quality and cost.
• Monitor KPIs like OEE, MTBA, MTBF, downtime, and utilization.
• Plan and execute preventive, predictive maintenance and equipment qualification.
• Lead reliability improvement projects including upgrades and automation.
• Support NPI, engineering builds, process transfers, and equipment buy-off.
• Develop and maintain SOPs, PM procedures, work instructions and reports.
• Coordinate with vendors on spare parts, PM programs, and upgrades.
• Analyze data to identify yield improvements and cost reductions.
• Collaborate with Production, Process Engineering, Quality, Maintenance and Manufacturing.

Skills

Troubleshooting

Root cause analysis

Cross-functional collaboration

Data analysis

Education

Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering

Tools

Preventive maintenance planning

Equipment qualification

Job description

Amkor Technology – Telok Panglima Garang, Selangor

Provide engineering support for Die Attach and Wire Bond equipment to ensure stable production performance, high equipment uptime, and optimum manufacturing efficiency.

Job Responsibilities:

Lead equipment troubleshooting and root cause analysis to resolve process and equipment-related issues in a timely manner

Drive continuous improvement initiatives to enhance equipment reliability, productivity, quality, and cost effectiveness

Monitor and improve key equipment performance indicators, including OEE, MTBA, MTBF, downtime, and utilization

Plan and execute preventive maintenance (PM), predictive maintenance, and equipment qualification activities

Lead equipment reliability improvement projects, including modification, upgrading, automation, and process optimization initiatives

Support new product introduction (NPI), engineering builds, process transfers, and equipment buy-off activities

Develop, review, and maintain equipment-related documentation including SOPs, PM procedures, work instructions, and technical reports

Coordinate with vendors and suppliers on equipment issues, spare parts management, preventive maintenance programs, and technical upgrades

Analyze equipment and process data to identify opportunities for yield improvement and cost reduction

Work closely with Production, Process Engineering, Quality, Maintenance, and Manufacturing teams to achieve operational targets

Job Requirement:

Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or equivalent

Minimum 2 years of experience in semiconductor manufacturing equipment engineering

Hands‑on experience supporting Die Attach and/or Wire Bond equipment in a semiconductor manufacturing environment

Strong troubleshooting and problem‑solving skills with systematic root cause analysis methodologies

Experience in equipment qualification, process validation, machine setup, and production support

Familiarity with equipment performance metrics such as OEE, MTBF, MTBA, and downtime analysis

Good communication and interpersonal skills with the ability to work effectively in a cross‑functional team environment

Self‑motivated, analytical, and capable of working independently with minimal supervision

Willing to support shift requirements, urgent equipment recovery activities, and manufacturing operational needs when required

Willing to work in Telok Panglima Garang (FIZ), Selangor.