Die Bond & Wire Bond Equipment Reliability Engineer

onsemi

Seremban

On-site

MYR 90,000 - 130,000

Full time

2 days ago

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Job summary

onsemi in Malaysia seeks an Equipment Engineer for Die Bond and Wire Bond systems. The role focuses on sustaining, maintaining, and improving manufacturing equipment, with emphasis on uptime, preventive/predictive maintenance, and continuous improvement.

Collaboration with Production, Process Engineering, Quality, and suppliers is essential. Responsibilities include troubleshooting, root cause analysis, implementing corrective actions, and leading automation and Industry 4.0 initiatives to

Qualifications

Bachelor’s Degree in Electrical & Electronics or related engineering field.
Diploma holders with 5+ years of relevant industry experience will be considered.
Minimum 2–5 years of experience in semiconductor equipment engineering.

Responsibilities

Provide engineering support for Die Bond and Wire Bond equipment to ensure high uptime.
Lead troubleshooting and root cause analysis for machine-related issues affecting production, yield or quality.
Develop and implement corrective and preventive actions to improve reliability.
Monitor and analyze OEE, MTBF, MTTR, utilization and downtime trends.
Lead continuous improvement and cost-reduction projects for equipment productivity.
Support equipment installation, setup, qualification, acceptance testing, and release to production.
Develop, optimize, and maintain preventive and predictive maintenance programs.
Work with suppliers to resolve technical issues and implement upgrades.
Drive automation, digitalization, and Industry 4.0 initiatives in equipment monitoring.