Equipment Engineer / Senior

OSI Optoelectronics; Johor Bahru; On-site; MYR 89,000 - 167,000; Full time

Job summary

OSI Optoelectronics in Malaysia is seeking an Equipment Engineer to set up and troubleshoot die attach and wire bonding machines, and support NPI and process changes.

You will work with leadership and cross-functional teams to monitor MTBA, MTBF, OEE, and PM, and to develop new processes with DOE, validation, and documentation. Candidates should have 3–5 years hands-on semiconductor equipment experience and a relevant engineering degree.

Qualifications

• Bachelor's degree in a mechanical/electrical/electronics/mechatronics/materials science
• Minimum 3–5 years hands-on semiconductor equipment experience, esp. die attach, wire bonding and laser marking
• Solid understanding of die attach materials, wire bonding mechanisms and semiconductor packaging assembly
• Experience with SPC and FMEA beneficial.

Responsibilities

• Equipment setup and troubleshooting for die attach and wire bonding machines.
• Support NPI, package transfer and process change activities including DOE, validation and documentation.
• Monitor KPI: MTBA, MTBF, OEE, machine downtime, quality and preventive maintenance.
• Perform initial setup for new production runs and assist development of new processes.
• Assist in equipment conversions and major troubleshooting to smooth production lines.
• Execute preventive maintenance and drive improvements to equipment capability.
• Collaborate with Lead Engineers, production and quality to improve processes and equipment performance.
• Maintain records of maintenance and repair work.
• Develop and execute installation and process validation protocols with validation reports for machine qualification.
• Knowledge of SPC and FMEA.

Skills

OEE concepts

MTBA/MTBF

Troubleshooting

Cross-functional collaboration

Problem-solving

Communication

Autonomous work

Education

Bachelor's degree in mechanical, Electrical, Electronics, Mechatronics, or Materials Science

Tools

Datacon 2200 evo

ASM Die bonders (AD838/AD830/AD896/AD810)

ASM I hawk / Express

Aero LED Gold / Aluminium wire bonders

Palomar 8000 Gold wire bonder / K&S

Laser marking machines

Job description

Equipment setup and troubleshooting for die attach and wire bonding machines.

Support NPI, package transfer and process change activities, including DOE, validation, and documentation.

Responsible for Equipment Engineering KPI which is MTBA, MTBF, OEE, machine downtime, Quality and Preventive maintenance.

Perform initial setup for new production runs and assist in the development of new processes.

Ability to perform assembly equipment conversion and major troubleshooting to ensure smoothed production line.

Ability to perform machine preventive maintenance job and to improve the equipment capability through continuous improvement activities.

Work closely with Lead Engineers, production and quality teams to improve the process and equipment performance.

Monitor the routine preventive maintenance and repairs on equipment and machinery done by technicians.

Maintain accurate records of maintenance and repair work.

Need to develop and execute the installation and process validation protocols and preparing the validation reports as part of new machine qualification.

Knowledge with Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA) .

Technical Skills

Equipment Knowledge: Hands-on experience in setup and troubleshooting the die attach machines( Datacon 2200 evo , ASM Die bonders – AD838 , AD830, AD896, AD810) , wire bonding machines ( ASM I hawk , ASM Express, Aero LED Gold and ASM Aluminium wire bonders , Palomar 8000 Gold wire bonder and K&S Gold wire bonder) and Laser marking machines.

Performance Metrics: Understanding of Overall Equipment Effectiveness (OEE), Mean Time Between Assists(MTBA), Mean Time Between Failures (MTBF), and Preventive Maintenance (PM) optimization.

Debugging & Troubleshooting: Diagnosing the electro-mechanical failures, pneumatic issues, vision system errors, and software glitches to minimize the machine downtime.

Preventive & Corrective Maintenance: Executing scheduled upkeep and emergency repairs to ensure maximum equipment OEE (Overall Equipment Effectiveness).

Soft Skills

Problem-Solving: Strong analytical capabilities to diagnose hardware malfunctions and minimize production downtime.

Communication: Effective interpersonal skills to collaborate with cross-functional manufacturing, quality, and process engineering teams

Individual Contributor : Ability to work independently and as part of a team for the new product setup and for any machine troubleshooting.

Education & Experience

Candidate must possess at least bachelor’s degree in mechanical, Electrical, Electronics, Mechatronics, Materials Science, or the related engineering discipline.

Minimum 3–5 years of hands-on experience in semiconductor industry , specifically with strong hands-on knowledge in die attach, wire bonding and laser marking machines. Strong hands-on experience in Datacon 2200 evo die attach machine will be an added advantage.

Solid understanding of die attach materials, wire bonding mechanisms and semiconductor packaging assembly .

Pharmaceuticals, Biotechnology & Medical Devices 101-1,000 employees

OSI Optoelectronics. Our OSI Optoelectronics division is a diversified developer and manufacturer of optoelectronic devices and value-added manufacturing services for use in a broad range of applications, including aerospace and defense electronics, security and inspection systems, and medical monitoring and diagnostics. This division provides products and services to original equipment manufacturers as well as to our own Rapiscan Systems and Spacelabs Healthcare divisions.

Product & Services

OSI Optoelectronics has been developing and manufacturing optoelectronics technologies and offering world-class manufacturing services for more than 40 years. OSI Optoelectronics. Light Sensing Ideas. We offer industry-leading, engineering solutions aligned with efficient manufacturing services available at locations across the globe.

As one of the largest manufacturers of standard and custom photodiode and optical sensors, we deliver engineering design support and manufacturing capabilities that include products for use in:

Aerospace and Defense

Life Sciences

Optical Communications

X-ray Applications

Test & Measurement

Industrial Applications

Consumer Products

OSI Optoelectronics. Our OSI Optoelectronics division is a diversified developer and manufacturer of optoelectronic devices and value-added manufacturing services for use in a broad range of applications, including aerospace and defense electronics, security and inspection systems, and medical monitoring and diagnostics. This division provides products and services to original equipment manufacturers as well as to our own Rapiscan Systems and Spacelabs Healthcare divisions.

Product & Services

OSI Optoelectronics has been developing and manufacturing optoelectronics technologies and offering world-class manufacturing services for more than 40 years. OSI Optoelectronics. Light Sensing Ideas. We offer industry-leading, engineering solutions aligned with efficient manufacturing services available at locations across the globe.

As one of the largest manufacturers of standard and custom photodiode and optical sensors, we deliver engineering design support and manufacturing capabilities that include products for use in: