Semiconductor Equipment Engineer – Die Attach & Wire Bond

Amkor Technology; Selangor; On-site; MYR 60,000 - 90,000; Full time

Job summary

Amkor Technology in Telok Panglima Garang, Selangor, seeks an equipment engineer to support Die Attach and Wire Bond systems, ensuring stable production performance and high uptime. You will troubleshoot, analyze root causes, and drive 개선 initiatives for reliability and cost efficiency.

You will monitor key metrics, plan PM activities, and support NPI, process transfers, and equipment qualification, collaborating with Production, Process Engineering, Quality, and Maintenance teams.

Qualifications

• Bachelor’s degree in a relevant engineering field.
• 2+ years of semiconductor equipment engineering experience.
• Hands-on support for Die Attach and/or Wire Bond equipment.
• Strong systematic root cause analysis and troubleshooting skills.
• Experience with equipment qualification and process validation.
• Familiarity with OEE, MTBF, MTBA, downtime analysis.
• Effective communication and cross-functional teamwork.
• Self-motivated, analytical, and able to work independently.
• Willing to support shift work and urgent recovery tasks.
• Willing to work in Telok Panglima Garang, Selangor.

Responsibilities

• Lead equipment troubleshooting and root cause analysis to resolve issues quickly.
• Drive continuous improvement for reliability, productivity, quality and cost.
• Monitor KPIs like OEE, MTBA, MTBF, downtime, and utilization.
• Plan and execute preventive, predictive maintenance and equipment qualification.
• Lead reliability improvement projects including upgrades and automation.
• Support NPI, engineering builds, process transfers, and equipment buy-off.
• Develop and maintain SOPs, PM procedures, work instructions and reports.
• Coordinate with vendors on spare parts, PM programs, and upgrades.
• Analyze data to identify yield improvements and cost reductions.
• Collaborate with Production, Process Engineering, Quality, Maintenance and Manufacturing.

Skills

Troubleshooting

Root cause analysis

Cross-functional collaboration

Data analysis

Education

Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering

Tools

Preventive maintenance planning

Equipment qualification

Job description

Amkor Technology in Telok Panglima Garang, Selangor, seeks an equipment engineer to support Die Attach and Wire Bond systems, ensuring stable production performance and high uptime. You will troubleshoot, analyze root causes, and drive 개선 initiatives for reliability and cost efficiency.

You will monitor key metrics, plan PM activities, and support NPI, process transfers, and equipment qualification, collaborating with Production, Process Engineering, Quality, and Maintenance teams.