Equipment Engineer – Die Attach & Wire Bond (Semiconductor)

Amkor Technology Malaysia Sdn Bhd; Teluk Panglima Garang; On-site; MYR 78,000 - 112,000; Full time

Benefits offered by this job

Medical

Dental

Sports (e.g. Gym)

Parking

In-house Clinic

In-house Cafeteria

Housing Int. Su

Job summary

Amkor Technology Malaysia Sdn Bhd is seeking an engineer to provide hands-on support for Die Attach and Wire Bond equipment in a semiconductor manufacturing environment in Teluk Panglima Garang, Selangor. You will lead troubleshooting, implement maintenance plans, and drive continuous improvements to achieve reliable production performance.

The role requires a Bachelor's degree in engineering and at least 2 years of experience in semiconductor equipment engineering, with strong problem-solving

Qualifications

• Bachelor's degree in engineering or equivalent.
• Minimum 2 years in semiconductor manufacturing equipment engineering.
• Hands-on support for Die Attach and/or Wire Bond equipment.

Responsibilities

• Lead equipment troubleshooting and root cause analysis to resolve issues promptly.
• Drive continuous improvement to enhance reliability, productivity, quality and cost.
• Plan and execute preventive/predictive maintenance and equipment qualification.

Skills

Troubleshooting

Root cause analysis

OEE monitoring

Preventive maintenance

Cross-functional collaboration

Education

Bachelor's Degree in Electrical/Electronics/Mechanical/Mechatronics/Manufacturing Engineering

Job description

Amkor Technology Malaysia Sdn Bhd is seeking an engineer to provide hands-on support for Die Attach and Wire Bond equipment in a semiconductor manufacturing environment in Teluk Panglima Garang, Selangor. You will lead troubleshooting, implement maintenance plans, and drive continuous improvements to achieve reliable production performance.

The role requires a Bachelor's degree in engineering and at least 2 years of experience in semiconductor equipment engineering, with strong problem-solving