Equipment Engineer - Die Attach & Wire Bonding Expert

Rapiscan Systems, Inc.; Malaysia; On-site; MYR 60,000 - 90,000; Full time

Job summary

OSI Optoelectronics in Malaysia seeks an Equipment Engineer to oversee the setup, maintenance, and troubleshooting of die attach, wire bonding, and laser marking machines for high-volume production. Role includes installation, maintenance, repair, and development of new processes, with a focus on optimizing MTBA, MTBF, and OEE while ensuring safe and efficient operations.

You will work with cross-functional teams to support NPIs, process transfers and DOE validation, maintaining thorough

Qualifications

• Bachelor’s degree in mechanical, Electrical, Electronics, Mechatronics, Materials Science, or a related engineering discipline.

Responsibilities

• Set up and troubleshoot die attach and wire bonding machines.
• Support NPIs, package transfer and process changes, including DOE, validation and documentation.
• Track Equipment Engineering KPIs: MTBA, MTBF, OEE, downtime, Quality, and PM.
• Perform initial setup for new production runs and assist in new process development.
• Maintain preventive maintenance and improve equipment capability via continuous improvement.
• Collaborate with Lead Engineers, production and quality teams to improve processes and equipment performance.
• Maintain records of maintenance and repair work and develop installation and validation protocols.

Job description

OSI Optoelectronics in Malaysia seeks an Equipment Engineer to oversee the setup, maintenance, and troubleshooting of die attach, wire bonding, and laser marking machines for high-volume production. Role includes installation, maintenance, repair, and development of new processes, with a focus on optimizing MTBA, MTBF, and OEE while ensuring safe and efficient operations.

You will work with cross-functional teams to support NPIs, process transfers and DOE validation, maintaining thorough