Equipment Engineer - Die Attach & Wire Bonding

OSI Optoelectronics; Johor; On-site; MYR 180,000 - 260,000; Full time

Job summary

OSI Optoelectronics is seeking a skilled Equipment Engineer to join our team in Malaysia. The role focuses on setup, maintenance, and troubleshooting of die attach, wire bonding, and laser marking machines to sustain high-volume production with strong OEE targets.

Ideal candidates will have 3–5 years in semiconductor equipment, hands-on experience with Datacon 2200 evo and various ASM bonders, and a solid grasp of SPC and FMEA for process improvement.

Qualifications

• Bachelor's degree in engineering (mechanical, electrical, electronics, mechatronics or related).
• 3–5 years hands-on semiconductor equipment experience focused on die attach, wire bonding and laser marking.
• Strong understanding of die attach materials and wire bonding mechanisms.

Responsibilities

• Set up, maintain, and troubleshoot die attach, wire bonding, and laser marking equipment.
• Install and repair equipment; ensure safe, efficient operation with KPI monitoring.
• Support NPI, process changes, DOE, validation, and documentation.
• Develop installation and process validation protocols with reporting.
• Collaborate with engineering, production and quality teams to improve performance.

Skills

Die attach handling

Wire bonding

Laser marking

Troubleshooting

Preventive maintenance

Process validation

SPC / FMEA

OEE metrics

Equipment setup

Education

Bachelor's degree in Mechanical / Electrical / Electronics / Mechatronics

Tools

Datacon 2200 evo

ASM die bonders – AD838 / AD830 / AD896 / AD810

ASM I hawk / Express / Aero LED Gold / ASM Aluminium wire bonders

Palomar 8000 Gold wire bonder

K&S Gold wire bonder

Laser marking machines

Job description

OSI Optoelectronics is seeking a skilled Equipment Engineer to join our team in Malaysia. The role focuses on setup, maintenance, and troubleshooting of die attach, wire bonding, and laser marking machines to sustain high-volume production with strong OEE targets.

Ideal candidates will have 3–5 years in semiconductor equipment, hands-on experience with Datacon 2200 evo and various ASM bonders, and a solid grasp of SPC and FMEA for process improvement.