Equipment Engineer

Rapiscan Systems, Inc.; Malaysia; On-site; MYR 60,000 - 90,000; Full time

Job summary

OSI Optoelectronics in Malaysia seeks an Equipment Engineer to oversee the setup, maintenance, and troubleshooting of die attach, wire bonding, and laser marking machines for high-volume production. Role includes installation, maintenance, repair, and development of new processes, with a focus on optimizing MTBA, MTBF, and OEE while ensuring safe and efficient operations.

You will work with cross-functional teams to support NPIs, process transfers and DOE validation, maintaining thorough

Qualifications

• Bachelor’s degree in mechanical, Electrical, Electronics, Mechatronics, Materials Science, or a related engineering discipline.

Responsibilities

• Set up and troubleshoot die attach and wire bonding machines.
• Support NPIs, package transfer and process changes, including DOE, validation and documentation.
• Track Equipment Engineering KPIs: MTBA, MTBF, OEE, downtime, Quality, and PM.
• Perform initial setup for new production runs and assist in new process development.
• Maintain preventive maintenance and improve equipment capability via continuous improvement.
• Collaborate with Lead Engineers, production and quality teams to improve processes and equipment performance.
• Maintain records of maintenance and repair work and develop installation and validation protocols.

Job description

Overview

OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for used in aerospace, defense, commercial and medical applications.

We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements.

OSI Optoelectronics is seeking a skilled Equipment Engineer to join our team. In this role, the successful candidate will be responsible for the setup, maintenance, and troubleshooting of die attach, wire bonding, and laser marking machines. As an Equipment Engineer, the primary responsibilities include the installation, maintenance, and repair of various types of die attach and wire bonding equipment, while ensuring that all equipment operates efficiently and safely.

Responsibilities

• Equipment setup and troubleshooting for die attach and wire bonding machines.
• Support NPI, package transfer and process change activities, including DOE, validation, and documentation.
• Responsible for Equipment Engineering KPI which is MTBA, MTBF, OEE, machine downtime, Quality and Preventive maintenance.
• Perform initial setup for new production runs and assist in the development of new processes.
• Ability to perform assembly equipment conversion and major troubleshooting to ensure smoothed production line.
• Ability to perform machine preventive maintenance job and to improve the equipment capability through continuous improvement activities.
• Work closely with Lead Engineers, production and quality teams to improve the process and equipment performance.
• Monitor the routine preventive maintenance and repairs on equipment and machinery done by technicians.
• Maintain accurate records of maintenance and repair work.
• Need to develop and execute the installation and process validation protocols and preparing the validation reports as part of new machine qualification.
• Knowledge with Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA) .
• Problem-Solving - Strong analytical capabilities to diagnose hardware malfunctions and minimize production downtime.
• Communication - Effective interpersonal skills to collaborate with cross-functional manufacturing, quality, and process engineering teams
• Individual Contributor - Ability to work independently and as part of a team for the new product setup and for any machine troubleshooting.
• Equipment Knowledge - Hands-on experience in setup and troubleshooting the die attach machines( Datacon 2200 evo , ASM Die bonders – AD838 , AD830, AD896, AD810) , wire bonding machines ( ASM I hawk , ASM Express, Aero LED Gold and ASM Aluminium wire bonders , Palomar 8000 Gold wire bonder and K&S Gold wire bonder) and Laser marking machines.
• Performance Metrics - Understanding of Overall Equipment Effectiveness (OEE), Mean Time Between Assists(MTBA), Mean Time Between Failures (MTBF), and Preventive Maintenance (PM) optimization.
• Debugging & Troubleshooting - Diagnosing the electro-mechanical failures, pneumatic issues, vision system errors, and software glitches to minimize the machine downtime.
• Preventive & Corrective Maintenance - Executing scheduled upkeep and emergency repairs to ensure maximum equipment OEE (Overall Equipment Effectiveness).

Qualifications

• Candidate must possess at least bachelor’s degree in mechanical, Electrical, Electronics, Mechatronics, Materials Science, or the related engineering discipline.
• Minimum 3–5 years of hands‑on experience in semiconductor industry , specifically with strong hands‑on knowledge in die attach, wire bonding and laser marking machines. Strong hands‑on experience in Datacon 2200 evo die attach machine will be an added advantage.
• Solid understanding of die attach materials, wire bonding mechanisms and semiconductor packaging assembly .