Senior Equipment Engineer - Semiconductor Packaging

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 48,000 - 72,000; Full time

Benefits offered by this job

Medical

Dental

Parking

Family medical support

Car subsidy

Job summary

Carsem is a leading semiconductor assembly and test provider with three factories, including two in Ipoh, Malaysia. This role oversees the maintenance of packaging and test equipment, guiding Technicians, driving improvements, and ensuring uptime across production lines.

The ideal candidate holds an Engineering degree, hands-on experience in ASM Die Attach or Wire Bond environments, and strong problem-solving skills.

Qualifications

• Bachelor's degree in Mechanical, Electrical, Electronic, Mechatronics, or related Engineering discipline.
• Experience in the semiconductor assembly industry, particularly in ASM Die Attach or Wire Bond, Alphasem Die Attach, and Esec Die Attach machines.
• Experience supervising, training, and guiding a team of Technicians.
• Strong knowledge of equipment maintenance, troubleshooting, and continuous improvement methodologies.
• Familiar with OEE, Downtime, MTBA, MTBF, and MTTR reporting and analysis.
• Experience in new equipment buy-off, setup, and vendor liaison.
• Good understanding of line audit processes (internal and external).
• Strong coordination, communication, and problem-solving skills.
• Hands-on, proactive, and able to work both independently and in a team.

Responsibilities

• Supervise, train and guide a team of Technicians on the maintenance of equipment, setting up machines, troubleshooting and continuous improvement projects.
• Plan, organize and implement equipment improvement and maintenance activities to ensure equipment is in good working condition.
• Handle machine breakdown, process analysis and reporting (OEE, Downtime, MTBA, MTBF and MTTR).
• Oversee new equipment buy-off and setup.
• Recommend plans to upgrade existing machines to improve productivity (OEE) and quality.
• Liaise with vendors and other department personnel to resolve machine issues and improve machine performance.
• Coordinate and work with support groups on work-related matters.
• Follow up on line audits, e.g. external and internal audits.
• Drive continuous improvement initiatives, e.g. Poka-Yoke/fool-proof project implementation.
• Act as 5S Zone Leader for area of responsibility.
• Medical Education support
• Dental
• Parking
• Medical for immediate family members
• car subsidy

Skills

Team leadership

Troubleshooting

Process analysis

Continuous improvement

Education

Engineering degree (Mechanical/Electrical/Electronic/Mechatronics)

Tools

OEE reporting

MTBA/MTBF/MTTR tracking

Equipment maintenance

Vendor liaison

Job description

Carsem is a leading semiconductor assembly and test provider with three factories, including two in Ipoh, Malaysia. This role oversees the maintenance of packaging and test equipment, guiding Technicians, driving improvements, and ensuring uptime across production lines.

The ideal candidate holds an Engineering degree, hands-on experience in ASM Die Attach or Wire Bond environments, and strong problem-solving skills.